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LGE Internal Use Only
Copyright © 01 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Process
Detail Guide
Description
Disassemble
Main Board
1. Disassemble
the main board
from the Phone.
. Detach gold
gasket tape from
shield-can via
pincette.
Main Board
Detach gold gasket tape
Cut off shield
can
1. Cut 4-point of
shield-can that
checked red
quadrangle via
nipper.
. Flowing iron
through applying
heat. In same
time lift a piece
of shield can with
a pincette.
3. Separated
shield-can throw
away.
Cut 4-points that checked
red quadrangle
Apply heat to
shield-can that
removing part
Shield-can cut
off Main board
Remove
Memory
1. Apply heat via
heat-gun.
. Pick up
through pincette
when complete
melting solder.
3. Polish-up
around of
Memory IC pad
via Solder paste
for deliberate
mounting
Memory IC.
Melt solder via heat-gun.
Polish up Memory IC pad area