Kontron AM4100, Руководство пользователя

Страница: 144 / 150

Thermal Considerations AM4100
Page 7 - 4 ID 36126, Rev. 2.0
P R E L I M I N A R Y
7.1.2 Board Thermal Monitoring
The AM4100 includes four board temperature sensors distributed over the complete board to
measure the board temperature (see Figure 7-2). The board temperature sensors are acces-
sible via the Module Management Controller.
The AM4100 uses the following board temperature sensors:
• Inlet board temperature sensor near the AMC Card-edge connector
(Inlet AMC Sensor)
• Outlet board temperature sensor near the AMC Card-edge connector
(Outlet AMC Sensor)
• Inlet board temperature sensor near the processor (Inlet Processor Sensor)
• Outlet board temperature sensor near the processor (Outlet Processor Sensor)
7.1.3 Processor Thermal Monitoring
The Freescale MPC8641D processor includes one die temperature sensor (Processor Sensor),
as illustrated in Figure 7-1.
Via the Processor Sensor, the Module Management Controller can measure the processor die
temperature.
The maximum die temperatures for all processor types is as follows:
• Freescale MPC8641D: all versions: 105 °C
7.2 CPU Internal Thermal Regulation
The Instruction Cache Throttling mechanism allows for the reduction of the CPU’s power con-
sumption and thus the CPU’s temperature. This mechanism requires a dedicated software
such as a thermal management application or an OS daemon. For further information about
the Instruction Cache Throttling, refer to the MPC8641D Integrated Host Processor Family Ref-
erence Manual.
7.3 External Thermal Regulation
The external thermal regulation of the AM4100 is realized using a dedicated heat sink in con-
junction with a system chassis that provides thermal supervision, controlled system airflow and
thermal protection, such as increased airflow, reduced ambient air temperature, or power re-
moval.
The heat sink provided on the AM4100 has been specifically designed to ensure the best pos-
sible basis for operational stability and long-term reliability. The physical size, shape, and con-
struction of the heat sink ensures the lowest possible thermal resistance. In addition, it has
been specifically designed to efficiently support forced airflow concepts as found in modern
AMC carriers and MicroTCA systems.