Panel PC USER’S MANUAL
Intel Platform, High Performance PPC
3
4.5.2.5 First/Second/Third Boot Device
.................................................................. 43
4.5.2.6 Boot Other Device
........................................................................................ 43
4.5.2.7 Swap Floppy Drive
....................................................................................... 43
4.5.2.8 Boot Up Floppy Seek
................................................................................... 43
4.5.2.9 Boot Up NumLock Status
............................................................................ 43
4.5.2.10 Gate A20 Option
........................................................................................... 43
4.5.2.11 Typematic Rate Setting
................................................................................ 43
4.5.2.12 Typematic Rate (Chars/Sec)
...................................................................... 43
4.5.2.13 Typematic Delay (Msec)
.............................................................................. 44
4.5.2.14 Security Option
............................................................................................. 44
4.5.2.15 APIC Mode
.................................................................................................... 44
4.5.2.16 MPS Version Control for OS
....................................................................... 44
4.5.2.17 OS Select for DRAM > 64MB
..................................................................... 44
4.5.2.18 Report No FDD For WIN 95
....................................................................... 44
4.5.2.19 Small Logo (EPA) Show
.............................................................................. 44
4.5.3 Advanced Chipset Features
............................................................................. 45
4.5.3.1 DRAM Timing Selectable
.............................................................................. 45
4.5.3.2 CAS Latency Time
.......................................................................................... 45
4.5.3.3 Active to Precharge Delay
............................................................................ 45
4.5.3.4 DRAM RAS# to CAS# Delay
........................................................................ 45
4.5.3.5 DRAM RAS# Precharge
................................................................................ 46
4.5.3.6 DRAM Data Integrity Mode
........................................................................... 46
4.5.3.7 MGM Core Frequency
................................................................................... 46
4.5.3.8 System BIOS Cacheable
.............................................................................. 46
4.5.3.9 Video BIOS Cacheable
.................................................................................. 46
4.5.3.10 Memory Hole At 15M-16M
.......................................................................... 46
4.5.3.11 Delayed Transaction
.................................................................................... 46
4.5.3.12 Delay Prior to Thermal
................................................................................. 46
4.5.3.13 AGP Aperture Size
....................................................................................... 47
4.5.3.14 On-Chip VGA
................................................................................................ 47
4.5.3.15 On-Chip Frame Buffer Size
........................................................................ 47
4.5.3.16 Boot Display
.................................................................................................. 47
4.5.3.17 TV Standard
.................................................................................................. 47
4.5.3.18 Video Connector
........................................................................................... 47
4.5.3.19 TV Format
...................................................................................................... 47
4.5.3.20 Panel Scaling
................................................................................................ 47
4.5.3.21 Panel Number
............................................................................................... 47
4.5.3.22 Panel Protocol
.............................................................................................. 48
4.5.4 Integrated Peripherals
....................................................................................... 48
4.5.4.1 OnChip Primary/Secondary PCI IDE
........................................................... 49
