Intel M50CYP2SB Series, Технические характеристики

Страница: 138 / 160

Intel® Server Board M50CYP2SB Family Technical Product Specification
138
H.2 Processor Replacement Instructions
Processors are part of an assembly referred to as a PHM (Processor Heat sink Module). A PHM consists of a
processor, a processor carrier clip, and the processor heat sink that is preassembled into a single module
before placement onto the processor socket assembly on the server board. The PHM concept reduces the
risk of damaging pins within the processor socket during the replacement process.
The system may use 1U (Low-profile) or 2U size processor heat sinks. The following procedures can be
applied to either option. The following procedure applies to processor heat sinks that are used by Intel for
use in its server systems. If the processor heat sink is different from the heat sink depicted in the following
procedures, then Intel recommends following the processor replacement procedures included within
documentation supplied with the chosen non-Intel server system.
Components Required:
• New matching 3 rd Gen Intel® Xeon® processor Scalable pro included shipping tray
• Existing processor carrier clip
• New processor heat sink or existing processor heat sink + new thermal interface material (TIM)
Note: Heat sinks are shipped pre-installed with TIM type Honeywell* PTM7000.
Required Tools and Supplies
• Anti-static wrist strap, an ESD safe workbench, and other anti-ESD precautions (recommended)
• ESD Gloves (recommended)
• T-30 Torx* screwdriver
Average Time to Complete: ~10+ minutes
Procedure Prerequisites
• The system must be powered off and AC Power cord(s) disconnected.
Caution: Fin edges of the processor heat sink are very sharp. Intel recommends wearing thin ESD protective
gloves when handling the PHM during the following procedures.
Caution:
Processor heat sinks are easily damaged if handled improperly. See the following image for proper
handling.