Intel® Server Board M50CYP2SB Family Technical Product Specification
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Table 55. Available Sensors Monitored by the BMC
Sensor #
Sensor Name
2Bh
Hot-swap Backplane 3 Temperature
(HSBP 3 Temp)
47h
P0 DIMM VR Mgn 1
48h
P0 DIMM VR Mgn 2
49h
P1 DIMM VR Mgn 1
4Ah
P1 DIMM VR Mgn 2
20h
Baseboard Temperature 1
(BB P1 VR Temp)
23h
Baseboard Temperature 2
(BB P2 VR Temp)
63h
P0 VR Ctrl Temp
64h
P0 VR Mgn
65h
P1 VR Ctrl Temp
66h
P1 VR Mgn
B0h
Processor 1 DIMM Aggregate Thermal Margin 1
(DIMM Thrm Mrgn 1)
B1h
Processor 1 DIMM Aggregate Thermal Margin 2
(DIMM Thrm Mrgn 2)
B2h
Processor 1 DIMM Aggregate Thermal Margin 3
(DIMM Thrm Mrgn 3)
B3h
Processor 1 DIMM Aggregate Thermal Margin 4
(DIMM Thrm Mrgn 4)
B4h
Processor 2 DIMM Aggregate Thermal Margin 1
(DIMM Thrm Mrgn 5)
B5h
Processor 2 DIMM Aggregate Thermal Margin 2
(DIMM Thrm Mrgn 6)
B6h
Processor 2 DIMM Aggregate Thermal Margin 3
(DIMM Thrm Mrgn 7)
B7h
Processor 2 DIMM Aggregate Thermal Margin 4
(DIMM Thrm Mrgn 8)
83h
P0 D1 DTS Th Mgn
84h
P0 D2 DTS Th Mgn
88h
P1 D1 DTS Th Mgn
89h
P1 D2 DTS Th Mgn
5Ch
Power Supply 1 Temperature
(PS1 Temperature)
5Dh
Power Supply 2 Temperature
(PS2 Temperature)
A8h
PHI 1 Thermal Margin
(PHI 1 Margin)
A9h
PHI 2 Thermal Margin
(PHI 2 Margin)
Содержание M50CYP2SB Series
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