Intel M50CYP2SB Series, Технические характеристики

Страница: 39 / 160

Intel® Server Board M50CYP2SB Family Technical Product Specification
39
4. Memory Support
This chapter describes the architecture that drives the memory subsystem, supported memory types,
memory population rules, and supported memory RAS features.
4.1 Memory Subsystem Architecture
The server board supports up to 32 DDR4 DIMMs, 16 per processor.
The 3 rd Gen Intel® Xeon® Scalable processors support eight memory channels using four integrated memory
controllers (IMCs). Each memory channel is assigned an identifying letter A-H, with each memory channel
supporting two DIMM slots
— slot 1 (blue slot) and slot 2 (black slot).
Figure 20. Memory Slot Connectivity
4.2 Supported Memory
The server board supports standard DDR4, RDIMMs, and LDRIMMs and Intel® O ptane™ persistent memory
200 series modules.
Server boards designed to support the 3 rd Generation Intel® Xeon® Scalable processors may be populated
with a combination of both DDR4 DR AM DIMMs and Intel® Optane™ persistent memory 200 series modules.
Note: Previous generation Intel® Optane™ persistent memory modules are not supported.
Intel® Optane™ persistent memory is an innovative technology that delivers a unique combination of
affordable large memory capacity and data persistence (non-volatility). It represents a new class of memory
and storage technology architected specifically for data center usage. The Intel® Optane™ persistent memory
200 series modules enable higher density (capacity per DIMM) DDR4-compatible memory modules with
near-DRAM performance and advanced features not found in standard SDRAM. The persistent memory
technology can help boost the performance of data-intensive applications, such as in-memory analytics,
databases, content delivery networks, and high performance computing (HPC), as well as deliver consistent
service levels at scale with higher virtual machine and container density.