Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor, Руководство по конструкции

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6 Thermal and Mechanical Design Guidelines
Figures
Figure 2-1. Package IHS Load Areas ..................................................................15
Figure 2-2. Processor Case Temperature Measurement Location ............................19
Figure 2-3. Example Thermal Profile ..................................................................20
Figure 3-1. Processor Thermal Characterization Parameter Relationships.................28
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX
Heatsink .......................................................................................31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ...31
Figure 4-1. Thermal Monitor Control ..................................................................35
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering .............................36
Figure 4-3. T
CONTROL
for Digital Thermal Sensor ....................................................39
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion..............................44
Figure 5-2. Random Vibration PSD ....................................................................46
Figure 5-3. Shock Acceleration Curve.................................................................46
Figure 5-4. Intel Type II TMA 65W Reference Design............................................49
Figure 5-5. Upward Board Deflection During Shock ..............................................50
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness .......................................................................................51
Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features ......52
Figure 6-1. E18764-001 Reference Design – Exploded View ..................................54
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease ......................54
Figure 6-3. Random Vibration PSD ....................................................................58
Figure 6-4. Shock Acceleration Curve.................................................................58
Figure 6-5. Upward Board Deflection During Shock ..............................................62
Figure 6-6. Reference Clip/Heatsink Assembly.....................................................63
Figure 6-7. Critical Parameters for Interfacing to Reference Clip.............................64
Figure 6-8. Critical Core Dimension ...................................................................64
Figure 7-1. Intel
®
QST Overview .......................................................................66
Figure 7-2. PID Controller Fundamentals ............................................................67
Figure 7-3. Intel
®
QST Platform Requirements ....................................................68
Figure 7-4. Example Acoustic Fan Speed Control Implementation...........................69
Figure 7-5. Digital Thermal Sensor and Thermistor ..............................................70
Figure 7-6. Board Deflection Definition...............................................................73
Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit .......75
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View ..78
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View ......79
Figure 7-10. Preload Test Configuration..............................................................79
Figure 7-11. Omega Thermocouple....................................................................86
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit .....88
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock
Exit (Old Drawing)........................................................................89
Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package ................90
Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the
LGA775 Socket ............................................................................90
Figure 7-16. Inspection of Insulation on Thermocouple.........................................91
Figure 7-17. Bending the Tip of the Thermocouple ...............................................92
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach .........92
Figure 7-19. Thermocouple Bead Placement........................................................93
Figure 7-20. Position Bead on the Groove Step....................................................94
Figure 7-21. Detailed Thermocouple Bead Placement ...........................................94