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Balanced Technology Extended (BTX) System Thermal Considerations

Thermal and Mechanical Design Guidelines

105

Appendix E

Balanced Technology

Extended (BTX) System
Thermal Considerations

There are anticipated system operating conditions in which the processor power may

be low but other system component powers may be high. If the only Fan Speed

Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the

processor sensor then the fan speed and system airflow is likely to be too low in this

operating state. Therefore, it is recommended that a second FSC circuit input be

acquired from an ambient temperature monitor location within the system.

The location of the System Monitor thermal sensor is best determined through

extensive system-level numerical thermal modeling or prototype thermal testing. In

either case, the temperature of critical components or the air temperature near critical

components should be assessed for a range of system external temperatures,

component powers, and fan speed operating conditions. The temperature at the

selected location for the System Monitor Point should be well correlated to the

temperatures at or near critical components. For instance, it may be useful to monitor

the temperature near the PSU airflow inlet, near the graphics add-in card, or near

memory.

The final system integrator is typically responsible for ensuring compliance with the

component temperature specifications at all operating conditions and, therefore,

should be responsible for specifying the System Monitor thermal sensor location.

However, it is not always possible for a board supplier – especially a channel board

supplier – to know the system into which a board will be installed. It is, therefore,

important for BTX board suppliers to select a System Monitor thermal sensor location

that will function properly in most systems.

A BTX system should be designed such that the TMA exhaust is the primary airflow

stream that cools the rest of the system. The airflow passes through the chipset

heatsink and its temperature will rise as the memory controller chipset power

increases. Since chipset power will increase when other subsystems (e.g. memory,

graphics) are active, a System Monitor thermal sensor located in the exhaust airflow

from the chipset heatsink is a reasonable location.

It is likely that a thermal sensor that is not mounted above the board and in the

chipset exhaust airflow will reflect board temperature and not ambient temperature. It

is therefore recommended that the Thermal sensor be elevated above the board.

Содержание BX80570E8200 - Core 2 Duo 2.66 GHz Processor

Страница 1: ...318734 011 Intel Core 2 Duo Processor E8000 and E7000 Series and Intel Pentium Dual Core Processor E6000 and E5000 Series and Intel Celeron Processor E3x00 Series Thermal and Mechanical Design Guideli...

Страница 2: ...or remains solely responsible for the design sale and functionality of its product including any liability arising from product infringement or product warranty Intel provides this information for cus...

Страница 3: ...s 21 2 3 1 Heatsink Size 22 2 3 2 Heatsink Mass 22 2 3 3 Package IHS Flatness 23 2 3 4 Thermal Interface Material 23 2 4 System Thermal Solution Considerations 24 2 4 1 Chassis Thermal Design Capabili...

Страница 4: ...5 4 Safety Requirements 49 5 5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly 49 5 6 Preload and TMA Stiffness 50 5 6 1 Structural Design Strategy 50 5 6 2 TMA Preload verse Stiff...

Страница 5: ...eparation 77 B 2 2 Typical Test Equipment 80 B 3 Test Procedure Examples 80 B 3 1 Time Zero Room Temperature Preload Measurement 81 B 3 2 Preload Degradation under Bake Conditions 81 Appendix C Therma...

Страница 6: ...uring Shock 62 Figure 6 6 Reference Clip Heatsink Assembly 63 Figure 6 7 Critical Parameters for Interfacing to Reference Clip 64 Figure 6 8 Critical Core Dimension 64 Figure 7 1 Intel QST Overview 66...

Страница 7: ...106 Figure 7 39 Thermal sensor Location Illustration 107 Figure 7 40 ATX ATX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Sheet 1 112 Figure 7 41 ATX ATX M...

Страница 8: ...low Requirements 44 Table 5 4 Processor Preload Limits 51 Table 6 1 E18764 001 Reference Heatsink Performance 55 Table 6 2 Acoustic Results for ATX Reference Heatsink E18764 001 56 Table 7 1 Board Def...

Страница 9: ...al core processor E5200 August 2008 005 Added Intel Core 2 Duo processor E7400 October 2008 006 Added Intel Pentium dual core processor E5300 December 2008 007 Added Intel Pentium dual core processor...

Страница 10: ...10 Thermal and Mechanical Design Guidelines...

Страница 11: ...mal solution All of these parameters are affected by the continued push of technology to increase processor performance levels and packaging density more transistors As operating frequencies increase...

Страница 12: ...ce design will be listed In this document when a reference is made to the datasheet the reader should refer to the Intel Core 2 Duo Processor E8000 and E7000 Series Datasheet Intel Pentium Dual Core P...

Страница 13: ...www formfactors org Thermally Advantaged Chassis Design Guide http www intel com go chassis 1 3 Definition of Terms Term Description TA The measured ambient temperature locally surrounding the proces...

Страница 14: ...t that can act to form a duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface Thermal Monitor A feature on the processor that att...

Страница 15: ...in the center of the socket with solder balls for surface mounting to the motherboard The socket is named LGA775 socket A description of the socket can be found in the LGA775 Socket Mechanical Design...

Страница 16: ...on removal mechanical stress testing and standard shipping conditions When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink b...

Страница 17: ...tecting LGA775 socket solder joints One of the strategies for mechanical protection of the socket is to use a preload and high stiffness clip This strategy is implemented by the reference design and d...

Страница 18: ...eatsink is assumed to be installed after the motherboard has been installed into the chassis Minimizes contact with the motherboard surface during installation and actuation to avoid scratching the mo...

Страница 19: ...al to the system For ATX platforms an active air cooled design assumed be used in ATX Chassis with a fan installed at the top of the heatsink equivalent to the reference design see Chapter 6 should be...

Страница 20: ...10 20 30 40 50 60 70 Power W Case Temperature C Thermal Profile TDP 2 2 4 TCONTROL TCONTROL defines the maximum operating temperature for the digital thermal sensor when the thermal solution fan spee...

Страница 21: ...onduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance The length thickness and conductivity of the c...

Страница 22: ...ut footprint definition and height restrictions for enabling components defined for the platforms designed with the LGA775 socket in Appendix G of this design guide The motherboard primary side height...

Страница 23: ...3 Package IHS Flatness The package IHS flatness for the product is specified in the datasheet and can be used as a baseline to predict heatsink performance during the design phase Intel recommends tes...

Страница 24: ...utions for ATX assume the use of the thermally advantaged chassis refer to Thermally Advantaged Chassis TAC Design Guide for TAC thermal and mechanical requirements The TAC 2 0 Design Guide defines a...

Страница 25: ...tions in heatsink design include The local ambient temperature TA at the heatsink which is a function of chassis design The thermal design power TDP of the processor and the corresponding maximum TC a...

Страница 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...

Страница 27: ...on that can rarely be accurately and easily modeled by a single resistance parameter like The case to local ambient thermal characterization parameter value CA is used as a measure of the thermal perf...

Страница 28: ...r IHS System Board TC Heatsink TIM TS TA CA LGA775 Socket Processor IHS System Board TC Heatsink 3 1 1 Example The cooling performance CA is defined using the principle of thermal characterization par...

Страница 29: ...ovided by Intel due to variances in the manufacturing process The TTV provides consistent power and power density for thermal solution characterization and results can be easily translated to real pro...

Страница 30: ...lements like memory cards graphic card and chipset heatsink If a barrier is used the thermocouple can be taped directly to the barrier with a clear tape at the horizontal location as previously descri...

Страница 31: ...ical Design Guidelines 31 Figure 3 2 Locations for Measuring Local Ambient Temperature Active ATX Heatsink Note Drawing Not to Scale Figure 3 3 Locations for Measuring Local Ambient Temperature Passiv...

Страница 32: ...and the complete measurement system must be routinely checked against known standards When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient...

Страница 33: ...e thermal management feature called Thermal Monitor is available on the processor It provides a thermal management approach to support the continued increases in processor frequency and performance By...

Страница 34: ...al designs to target maximum sustained current instead of maximum current Systems should still provide proper cooling for the VR and rely on bi directional PROCHOT signal only as a backup in case of s...

Страница 35: ...t represents the normal operating condition for the processor The second operating point consists of both a lower operating frequency and voltage When the TCC is activated the processor automatically...

Страница 36: ...al Control Circuit while using various registers and outputs to monitor the processor thermal status The Thermal Control Circuit is enabled by the BIOS setting a bit in an MSR model specific register...

Страница 37: ...to approximately 1 s on time 1 s total cycle time 3 1 s duty cycle Similarly for a duty cycle of 7 8 87 5 the clock on time would be extended to 21 s 21 21 3 7 8 duty cycle In a high temperature situa...

Страница 38: ...ximately 20 to 25 C At this point the system bus signal THERMTRIP goes active and power must be removed from the processor THERMTRIP activation is independent of processor activity and does not genera...

Страница 39: ...issipation The DTS TCONTROL value is factory configured and is written into TOFFSET MSR the BIOS can read the TOFFSET MSR and provide this value to the fan speed control device Figure 4 3 TCONTROL for...

Страница 40: ...QST see Chapter 7 and the Intel Quiet System Technology Configuration and Tuning Manual Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers Cons...

Страница 41: ...bient temperature to the chassis of across the fan inlet resulting in a temperature rise TR of 0 5 C Meeting TA and CA targets can maximize processor performance refer to Sections 2 2 2 4 and Chapter...

Страница 42: ...mance is defined in terms of measured sound power LwA as defined in ISO 9296 standard and measured according to ISO 7779 2 Acoustic testing will be for the TMA only when installed in a BTX S2 chassis...

Страница 43: ...orms Because of the coupling between TMA thermal performance and system impedance the designer should understand the TMA effective fan curve This effective fan curve represents the performance of the...

Страница 44: ...Module to provide effective cooling for the voltage regulator VR chipset and system memory components on the motherboard The Thermal Module is required to have features that allow for airflow to bypa...

Страница 45: ...atsink will be validated within the specific boundary conditions based on the methodology described Section 5 2 and using a thermal test vehicle Testing is done in a BTX chassis at ambient lab tempera...

Страница 46: ...Hz 3 dB Control Limit 3 dB Control Limit 5 2 1 2 Shock Test Procedure Recommended performance requirement for a system Quantity 2 drops for and directions in each of 3 perpendicular axes i e total 12...

Страница 47: ...damage to the heatsink attach mechanism including such items as clip and motherboard fasteners 2 Heatsink must remain attached to the motherboard 3 Heatsink remains seated and its bottom remains mated...

Страница 48: ...pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 5 3 Material and Recycling Requirements Material...

Страница 49: ...can access the moving parts of the fan consider adding safety feature so that there is no risk of personal injury 5 5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly Figure 7 43 thr...

Страница 50: ...atic preload to ensure protection against fatigue failure of socket solder joint The allowable preload range for BTX platforms is provided in Table 5 4 but the specific target value is a function of t...

Страница 51: ...hown is the acceptable domain for Thermal Module assembly effective stiffness and processor preload combinations The Thermal Module design should have a design preload and stiffness that lies within t...

Страница 52: ...attach point use 6x32 screw See detail A Detail A See detail B Detail B Rear attach point use 6x32 screw Chassis PEM nut Duct front interface feature see note 2 SRM Front attach point use 6x32 screw S...

Страница 53: ...w of this reference design Note The part number E18764 001 provided in this document is for reference only The revision number 001 may be subject to change without notice The E18764 001 reference desi...

Страница 54: ...Section 6 6 remain the same for a thermal solution for the processor in the 775 Land LGA package Note If this fan design is used in your product and you will deliver it to end use customers you have...

Страница 55: ...n at the processor fan heatsink inlet discussed Section 2 4 1 Table 6 1 E18764 001 Reference Heatsink Performance Processor Target Thermal Performance ca Mean 3 TA Assumption Notes Intel Core 2 Duo Pr...

Страница 56: ...1 Acoustic performance is defined in terms of measured sound power LwA as defined in ISO 9296 standard and measured according to ISO 7779 While the fan hub thermistor helps optimize acoustics at high...

Страница 57: ...ion factors Note The above 81 28 mm obstruction height that is used for testing complies with the recommended obstruction height of 88 9 mm for the ATX form factor However it would conflict with syste...

Страница 58: ...01 20 0 02 500 0 02 6 3 1 2 Shock Test Procedure Recommended performance requirement for a motherboard Quantity 3 drops for and directions in each of 3 perpendicular axes i e total 18 drops Profile 50...

Страница 59: ...hysical damage to the heatsink attach mechanism including such items as clip and motherboard fasteners 2 Heatsink must remain attached to the motherboard 3 Heatsink remains seated and its bottom remai...

Страница 60: ...n is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 6 4 Material and Recycling Requirements Material shall be resis...

Страница 61: ...anical Design Figure 7 40 Figure 7 41 and Figure 7 42 in Appendix G gives detailed reference ATX ATX motherboard keep out information for the reference thermal mechanical enabling design These drawing...

Страница 62: ...particular upward board deflection Figure 6 5 In addition a moderate preload provides initial downward deflection Figure 6 5 Upward Board Deflection During Shock The target metal clip nominal stiffne...

Страница 63: ...insertion and is meant to be trapped between the core shoulder and the extrusion as shown in Figure 6 6 Figure 6 6 Reference Clip Heatsink Assembly Core shoulder traps clip in place Core shoulder tra...

Страница 64: ...p Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Figure 6 8 Critical Core Dimension R 0 40 mm max R 0 40 mm max 36 14 0 10 mm G...

Страница 65: ...tel QST in particular rely on a thermal solution being compliant to the processor thermal profile It is unlikely that any fan speed control algorithm can compensate for a non compliant thermal solutio...

Страница 66: ...gle fan respond to this sensor 7 1 2 Proportional Integral Derivative PID The use of Proportional Integral Derivative PID control algorithms allow the magnitude of fan response to be determined based...

Страница 67: ...emperature Limit Temperature For a PID algorithm to work limit temperatures are assigned for each temperature sensor For Intel QST the TCONTROL for the processor and chipset are to be used as the limi...

Страница 68: ...reserved for Intel QST FW execution SPI Flash with sufficient space for the Intel QST Firmware SST based thermal sensors to provide board thermal data for Intel QST algorithms Intel QST firmware Figu...

Страница 69: ...ration information the ME can be accommodate inputs from PECI or SST for the processor socket Additional SST sensors can be added to monitor system thermal see Appendix E for BTX recommendations for p...

Страница 70: ...rol between Intel QST and the thermistor but they can work in tandem to provide the maximum fan speed reduction The BTX reference design includes a thermistor on the fan hub This Variable Speed Fan cu...

Страница 71: ...actuated In addition solder joint shear stress is caused by coefficient of thermal expansion CTE mismatch induced shear loading The solder joint compressive axial force Faxial induced by the heatsink...

Страница 72: ...n metric provides guidance for mechanical designs that differ from the reference design for ATX ATX form factor A 3 1 Motherboard Deflection Metric Definition Motherboard deflection is measured along...

Страница 73: ...n Limits Deflection limits for the ATX ATX form factor are d_BOL d_ref 0 09 mm and d_EOL d_ref 0 15 mm And d _BOL d _ref 0 09 mm and d_EOL d_ref 0 15 mm NOTES 1 The heatsink preload must remain within...

Страница 74: ...creep phenomenon The example accounts for the creep expected to occur in the motherboard It assumes no creep to occur in the clip However there is a small amount of creep accounted for in the plastic...

Страница 75: ...eflect 0 37 mm minimum at BOL Additional deflection as high as 0 09 mm may be necessary to account for additional creep effects impacting the board clip fastener assembly As a result designs could see...

Страница 76: ...to meet the board deflection recommendation refer to Section A 3 2 with a very stiff board may lead to heatsink preloads exceeding package maximum load specification For example such a situation may o...

Страница 77: ...ould be distributed evenly as close as possible to the pocket walls Apply wax around the circumference of each load cell and the surface of the pocket around each cell to maintain the load cells in pl...

Страница 78: ...gn is Machine the pocket in the heat sink base to a depth such that the tips of the load cells are just flush with the heat sink base Then machine back the heatsink base by around 0 25 mm 0 01 so that...

Страница 79: ...eatsink Base Pocket Side View Figure 7 10 Preload Test Configuration Load Cells 3x Preload Fixture copper core with milled out pocket Wax to maintain load cell in position during heatsink installation...

Страница 80: ...ta recording and control with a 6101 PCI card GPIB added to the scanner allowing it to be connected to a PC running LabVIEW or Vishay s StrainSmart software 4 IMPORTANT In addition to just a zeroing o...

Страница 81: ...m time to allow the load cell to settle is generally specified by the load vendors often of order of 3 minutes The time zero reading should be taken at the end of this settling time 5 Record the prelo...

Страница 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...

Страница 83: ...a do not translate to a measurable improvement in thermal performance C 3 Interface Material Performance Two factors impact the performance of the interface material between the processor and the heat...

Страница 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...

Страница 85: ...IHS followed by the reference procedure The supplier is listed the table below as a convenience to Intel s general customers and the list may be subject to change without notice Supplier Contact Phon...

Страница 86: ...ormation OSK2K1280 5SR TC TT T 36 72 Calibration and Control Ice Point Cell Omega stable 0 C temperature source for calibration and offset TRCIII Hot Point Cell Omega temperature source to control and...

Страница 87: ...ly impacted by impedance There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements NOTES 1 It is recommended to follow co...

Страница 88: ...Case Temperature Reference Metrology 88 Thermal and Mechanical Design Guidelines Figure 7 12 775 LAND LGA Package Reference Groove Drawing at 6 o clock Exit...

Страница 89: ...Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 89 Figure 7 13 775 LAND LGA Package Reference Groove Drawing at 3 o clock Exit Old Drawing...

Страница 90: ...otch as shown Figure 7 15 Figure 7 15 IHS Groove at 6 o clock Exit Orientation Relative to the LGA775 Socket Select a machine shop that is capable of holding drawing specified tolerances IHS groove ge...

Страница 91: ...ing and Preparation 1 Use a calibrated thermocouple as specified in Sections D 2 and D 3 2 Under a microscope verify the thermocouple insulation meets the quality requirements The insulation should be...

Страница 92: ...wire and bead extend about 1 5 mm 0 030 inch past the end of groove Secure it with Kapton tape Figure 7 18 Clean the IHS with a swab and IPA 8 Verify under the microscope that the thermocouple wires a...

Страница 93: ...t is also recommended to use a fixture like processor tray or a plate to help holding the unit in place for the rest of the attach process 11 While still at the microscope press the wire down about 6m...

Страница 94: ...n Guidelines Figure 7 20 Position Bead on the Groove Step Figure 7 21 Detailed Thermocouple Bead Placement TC Wire with Insulation IHS with Groove TC Bead Figure 7 22 Third Tape Installation Wire sect...

Страница 95: ...ng process 13 Measure resistance from thermocouple end wires hold both wires to a DMM probe to the IHS surface This should be the same value as measured during the thermocouple conditioning Section D...

Страница 96: ...lux to the Thermocouple Bead 15 Cut two small pieces of solder 1 16 inch 0 065 inch 1 5 mm from the roll using tweezers to hold the solder while cutting with a fine blade Figure 7 25 Figure 7 25 Cutti...

Страница 97: ...ontacting the IHS D 5 3 Solder Process 18 Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block Connect the thermocouple to a handheld meter to monito...

Страница 98: ...e to the device in the solder status to get a better view when the solder begins to melt 23 Lower the Heater block onto the IHS Monitor the device IHS temperature during this step to ensure the maximu...

Страница 99: ...Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 99 Figure 7 28 View Through Lens at Solder Station Figure 7 29 Moving Solder back onto Thermocouple Bead...

Страница 100: ...ature with a handheld meter until it drops below 50 C before moving it to the microscope for the final steps D 5 4 Cleaning Completion of Thermocouple Installation 27 Remove the device from the solder...

Страница 101: ...l solder is flush with the groove surface Figure 7 32 Figure 7 32 Removing Excess Solder Note Take usual precautions when using open blades 30 Clean the surface of the IHS with Alcohol and use compres...

Страница 102: ...l and Mechanical Design Guidelines Figure 7 33 Filling Groove with Adhesive 32 To speed up the curing process apply Loctite Accelerator on top of the Adhesive and let it set for a couple of minutes Fi...

Страница 103: ...This will help to keep the adhesive surface flat and smooth with no pits or voids If there are voids in the adhesive refill the voids with adhesive and shave a second time 34 Clean IHS surface with I...

Страница 104: ...e wrong For example if there are any cuts into the wires insulation where the wires are pinched between the heatsink and the socket lid when installing the heatsink the thermocouple wires can get in c...

Страница 105: ...ponents For instance it may be useful to monitor the temperature near the PSU airflow inlet near the graphics add in card or near memory The final system integrator is typically responsible for ensuri...

Страница 106: ...al sensor The following thermal sensor or its equivalent can be used for this function Part Number C83274 002 BizLink USA Technology Inc 44911 Industrial Drive Fremont CA 94538 USA 510 252 0786 phone...

Страница 107: ...Balanced Technology Extended BTX System Thermal Considerations Thermal and Mechanical Design Guidelines 107 Figure 7 39 Thermal sensor Location Illustration TMA Airflow Thermal Sensor MCH Heatsink...

Страница 108: ...Balanced Technology Extended BTX System Thermal Considerations 108 Thermal and Mechanical Design Guidelines...

Страница 109: ...tage for logic low VIL 0 8 V PWM compliant function RPM must be within spec for specified duty cycle In addition to comply with overall thermal requirements Sections 5 1 1 and 6 2 and the general envi...

Страница 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...

Страница 111: ...TX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Sheet 2 113 ATX ATX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Componen...

Страница 112: ...OMPONENT HEIGHT BOARD ROUTING KEEP OUT SHEET 1 OF 3 DO NOT SCALE DRAWING SCALE NONE 3 C40819 D REV DRAWING NUMBER CAGE CODE SIZE LGA775 microATX COMPONENT KEEP INS TITLE 2200 MISSION COLLEGE BLVD P O...

Страница 113: ...E DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION 4X 6 00 4X 10 00 LEGEND COMPONENT KEEP OUT ROUTING KEEP OUT SHEET 2 OF 3 DO NOT SCALE DRAWING SCA...

Страница 114: ...D REV DRAWING NUMBER CAGE CODE SIZE DEPARTMENT C40819 3 3 DWG NO SHT REV LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLATE NOTES 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF...

Страница 115: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 115 Figure 7 43 BTX Thermal Module Keep Out Volumetric Sheet 1...

Страница 116: ...Mechanical Drawings 116 Thermal and Mechanical Design Guidelines Figure 7 44 BTX Thermal Module Keep Out Volumetric Sheet 2...

Страница 117: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 117 Figure 7 45 BTX Thermal Module Keep Out Volumetric Sheet 3...

Страница 118: ...Mechanical Drawings 118 Thermal and Mechanical Design Guidelines Figure 7 46 BTX Thermal Module Keep Out Volumetric Sheet 4...

Страница 119: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 119 Figure 7 47 BTX Thermal Module Keep Out Volumetric Sheet 5...

Страница 120: ...3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE UNCONSTRAINED STATE UNLESS INDICATED OTHERWISE 2 MATERIAL A TYPE AISI...

Страница 121: ...22 45 X 8 0 45 0 05 018 001 45 X 8 0 25 0 05 010 001 C85609 2 0 DWG NO SHT REV DEPARTMENT R CORP 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 TMD SIZE DRAWING NUMBER REV A1 C85609...

Страница 122: ...Mechanical Drawings 122 Thermal and Mechanical Design Guidelines Figure 7 50 Reference Fastener Sheet 1...

Страница 123: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 123 Figure 7 51 Reference Fastener Sheet 2...

Страница 124: ...Mechanical Drawings 124 Thermal and Mechanical Design Guidelines Figure 7 52 Reference Fastener Sheet 3...

Страница 125: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 125 Figure 7 53 Reference Fastener Sheet 4...

Страница 126: ...IGNED BY DRAWN BY CHECKED BY APPROVED BY DATE DATE DATE DATE DO NOT SCALE DRAWING SCALE 1 1 SHEET 1 OF 1 DRAWING NUMBER CAGE CODE SIZE C TITLE DEPARTMENT R REV 5000 W CHANDLER BLVD CHANDLER ARIZONA 85...

Страница 127: ...isted below identifies these reference components End users are responsible for the verification of the Intel enabled component offerings with the supplier OEMs and System Integrators are responsible...

Страница 128: ...usion TBD Harry Lin Monica Chih 714 739 5797 886 2 29952666 Extension 131 AVC ASIA Vital Components Co Ltd Fan and Duct TBD David Chao 886 2 22996930 Extension 619 NOTES 1 Part numbers were not availa...

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