Chapter
5.
Service
replaceable
units
This
chapter
describes
the
removal
of
server
components.
Important:
The
field
replaceable
unit
(FRU)
procedures
are
intended
for
trained
servicers
who
are
familiar
with
IBM
xSeries
products.
See
the
parts
listing
in
“System”
on
page
162
to
determine
if
the
component
being
replaced
is
a
customer
replaceable
unit
(CRU)
or
a
FRU.
Thermal
grease
This
section
contains
information
about
removing
and
replacing
the
thermal
grease
between
the
heat
sink
and
the
microprocessor.
The
thermal
grease
must
be
replaced
anytime
the
heat
sink
has
been
removed
from
the
top
of
the
microprocessor
and
is
going
to
be
reused,
or
when
debris
is
found
in
the
grease.
Note:
v
Read
“Installation
guidelines”
on
page
45.
v
Read
the
safety
notices
at
“Safety
information”
on
page
169.
v
Read
“Handling
electrostatic
discharge-sensitive
devices”
on
page
172.
Complete
the
following
steps
to
replace
damaged
or
contaminated
thermal
grease
on
the
microprocessor
and
heat
sink:
1.
Place
the
heat
sink
on
a
clean
work
surface.
2.
Remove
the
cleaning
pad
from
its
package
and
unfold
it
completely.
3.
Use
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
bottom
of
the
heat
sink.
Note:
Be
sure
that
all
of
the
thermal
grease
is
removed.
4.
Use
a
clean
area
of
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
microprocessor;
then,
dispose
of
the
cleaning
pad
after
all
of
the
thermal
grease
is
removed.
Microprocessor
0.01 mL of
thermal grease
5.
Use
the
thermal
grease
syringe
to
place
16
uniformly
spaced
dots
of
0.01mL
each
on
the
top
of
the
microprocessor.
©
Copyright
IBM
Corp.
2002
115
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