Description
Chassis
Fan configuration Number of drives
supported by the
server
Maximum inlet
ambient
temperature
Processor
with a TDP
between 115
W and 130 W
Apollo DX2200
Gen10 Chassis
(12 LFF backplane)
Redundant and
nonredundant
30°C (86°F)
Not supported
35°C (95°F)
Apollo DX2600
Gen10 Chassis
(24 SFF or 16 SFF
+ 8 NVMe
backplane)
Redundant and
nonredundant
0 to 6 drives
35°C (95°F)
Apollo DX2800
Gen10 Chassis
(24 SFF backplane
with SAS expander)
Redundant and
nonredundant
0 to 24 drives
35°C (95°F)
Apollo DX2800
Gen10 Chassis
(16 NVMe
backplane)
Redundant and
nonredundant
0 to 4 drives
35°C (95°F)
The drive capacity must be less than 10 TB.
The drive capacity must be greater than or equal to 10 TB.
If the component is installed in server 1 or server 2, and the server is installed in the Apollo DX2200 Gen10 Chassis,
drive blanks must be installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3 or server 4,
and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and
4-2.
DIMMs
NOTE:
In nonredundant fan configuration, 32 GB RDIMM and 64 GB LRDIMM can support up to 35°C
(95°F) temperature.
NOTE:
HPE Persistent Memory module does not support enhanced processor performance.
Description
Chassis
Fan configuration
Number of drives
supported by the
server
Maximum inlet
ambient temperature
32 GB RDIMM Apollo
DX2200
Gen10
Chassis
(12 LFF
backplane)
Redundant
30°C (86°F)
Not supported
35°C (95°F)
Table Continued
Specifications
105
