Develop D 2500iD, Руководство по обслуживанию

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FrameMaker Ver.5.5E(PC) Di250 DIS/REASSEMBLY, ADJUSTMENT
99.01.07
D-2
The following precautions must be observed when handling P.W. Boards with MOS
(Metal Oxide Semiconductor) ICs.
During Transportation/Storage:
•
During transportation or when in storage, new P.W. Boards must not be indiscriminately
removed from their protective conductive bags.
•
Do not store or place P.W. Boards in a location exposed to direct sunlight.
•
When it becomes absolutely necessary to remove a Board from its conductive bag or
case, always place it on its conductive mat in an area as free as possible from static elec-
tricity.
•
Do not touch the pins of the ICs with your bare hands.
During Replacement:
•
Before unplugging connectors from the P.W. Boards, make sure that the power cord has
been unplugged from the outlet.
•
When removing a Board from its conductive bag or conductive case, do not touch the
pins of the ICs or the printed pattern. Place it in position by holding only the edges of the
Board.
•
Before plugging connectors into the Board, make sure that the power cord has been
unplugged from the power outlet.
During Inspection:
•
Avoid checking the IC directly with a multimeter; use connectors on the Board.
•
Never create a closed circuit across IC pins with a metal tool.
•
When it is absolutely necessary to touch the ICs and other electrical components on the
PW Board, be sure to ground your body.
During Transportation/Storage:
•
Use the specified carton whenever moving or storing the Imaging Cartridge.
•
The storage temperature is in the range between –20°C and +40°C.
•
In summer, avoid leaving the Imaging Cartridge in a car for a long time.
Handling:
•
Ensure that the correct Imaging Cartridge is used.
•
Store the Imaging Cartridge in a site that is not exposed to direct sunlight.
Precautionary Information on the PC Drum Inside the Imaging Cartridge:
•
The PC Drum exhibits greatest light fatigue after being exposed to strong light over an
extended period of time. Never, therefore, expose it to direct sunlight.
•
Use care not to contaminate the surface of the PC Drum with oil-base solvent, finger-
prints, and other foreign matter.
•
Do not scratch the surface of the PC Drum.
•
Do not apply chemicals to the surface of the PC Drum.
•
Do not attempt to wipe clean the surface of the PC Drum.
1-3. INSTRUCTIONS FOR HANDLING THE PWBs WITH MOS ICs
1-4. HANDLING OF THE IMAGING CARTRIDGE