Document Number: 002-00948 Rev. *C
Page 11 of 74
S29CD032J
S29CD016J
S29CL032J
S29CL016J
5.3
80-Ball Fortified BGA Connection Diagram
Notes
6. On 16 Mb device, ball D3 (A19) is NC.
7. Ball F5 (RY/BY#) is Open Drain and requires an external pull-up resistor.
5.4
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (BGA). The package and/or data integrity may be
compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.
B3
C3
D3
E3
F3
G3
H3
B4
C4
D4
E4
F4
G4
H4
B5
C5
D5
E5
F5
G5
H5
B6
C6
D6
E6
F6
G6
H6
B7
C7
D7
E7
F7
G7
H7
B8
C8
D8
E8
F8
G8
H8
DQ20
V
IO
V
SS
V
IO
DQ29
A0
A1
DQ18
DQ23
DQ24
DQ26
DQ30
NC
A4
DQ19
DQ21
DQ25
DQ28
DQ31
A7
A5
DQ17
DQ22
RY/BY#
DQ27
NC
NC
A8
WP#
DQ9
DQ5
DQ1
NC
A10
A9
DQ11
DQ10
DQ6
DQ2
A19
A11
A12
A3
A4
A5
A6
A7
A8
A2
A3
A6
V
SS
ACC
V
CC
B2
C2
D2
E2
F2
G2
H2
DQ12
DQ8
DQ7
DQ4
DQ0
A18
A13
A2
A14
B1
C1
D1
E1
F1
G1
H1
DQ13
J3
J4
J5
J6
J7
J8
DQ16
IND/WAIT#
OE#
CE#
NC
ADV#
J2
DQ14
J1
DQ15
K3
K4
K5
K6
K7
K8
NC
NC
WE#
V
CC
V
SS
CLK
K2
RESET#
K1
V
IO
V
IO
V
SS
V
IO
DQ3
A17
A16
A1
A15