EES3 Hardware Interface Description
Contents
EES3_HD_v01.100b
Page 5 of 118
2009-08-12
Confidential / Released
Voiceband Receive Path..................................................................... 95
Voiceband Transmit Path.................................................................... 97
Mechanical Dimensions of EES3................................................................... 100
Mounting EES3 onto the Application Platform ............................................... 102
6.2.1
Land Pattern and Stencil ................................................... 102
Board Level Characterization............................................ 103
Moisture Sensitivity Level ................................................................. 104
Soldering Conditions and Temperature ............................................ 104
6.2.3.1
Reflow Profile .................................................................... 104
Maximum Temperature and Duration................................ 105
Durability and Mechanical Handling.................................................. 106
6.2.4.1
Storage Life ....................................................................... 106
Processing Life.................................................................. 106
Baking ............................................................................... 106
Electrostatic Discharge...................................................... 106
Orientation......................................................................... 107
Barcode Label ................................................................... 108
Moisture Barrier Bag ......................................................... 109
Transportation Box .............................................................111
Reference Equipment for Type Approval....................................................... 114
Compliance with FCC and IC Rules and Regulations ................................... 115