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AMD SP5100 Databook
44409 Rev. 1.70 October 10
76
Thermal Information
13 Thermal Information
This section describes some key thermal parameters of the SP5100. For a detailed discussion on these
parameters and other thermal design descriptions including package level thermal data and analysis,
please consult the
Thermal Design and Analysis Guidelines for SP5100
.
Table 13-1
SP5100 Thermal Limits
Parameter
Minimum
Nominal
Maximum
Unit
Note
Operating Case
Temperature
0
—
105
°
C
1
Absolute Rated Junction
Temperature
—
—
125
°
C
2
Storage Temperature
-40
—
60
°
C
Ambient Temperature
0
—
55
°
C
3
Thermal Design Power
—
4.5
—
W
4
Notes:
1 - The maximum operating case temperature is the die geometric top-center temperature measured
through proper thermal contact to the back side of the die based on the methodology given in the
document
Thermal Design and Analysis Guidelines for SP5100
(Chapter 11). This is the temperature at
which the functionality of the chip is qualified.
2 - The maximum absolute rated junction temperature is the junction temperature at which the device can
operate without causing damage to the ASIC.
3 - The ambient temperature is defined as the temperature of the local intake air to the thermal
management device. The maximum ambient temperature is dependent on the heat sink's local ambient
conditions as well as the chassis' external ambient, and the value given here is based on AMD’s reference
server heat sink solution for the SP5100. Refer to Chapter 5 in the
Thermal Design and Analysis
Guidelines for SP5100
for heat sink and thermal design guidelines. Refer to Chapter 6 of the above
mentioned document for details of ambient conditions.
4 - Thermal Design Power (TDP) is defined as the highest power dissipated while running currently
available worst case applications at nominal voltages. The core voltage was raised to 5% above its
nominal value for measuring the ASIC power. Since the core power of modern ASICs using 65nm and
smaller process technology can vary significantly, parts specifically screened for higher core power were
used for TDP measurement. The TDP is intended only as a design reference, and the value given here is
preliminary.