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409-1993
AMP-TAPETRONIC Machines 69875 and 69875-1
Rev J
33 of 46
Tyco Electronics Corporation
Figure 27
Chamfer ForwardEdge of Mount
.38 X .38 mm [.015 X .015 In.]
Retaining
Plate
Mount
Offset of Die Must Seat Tightly
Against Bottom Edge of Mount,
Then Tighten Die Screw
Moving Die
Figure 28
When Dies are Aligned,
Push Indexing Mechanism
TowardRear of Machine:
Then Tighten Screws in
Holder
Dies Must
Align
Tape Release
Lever Lowered