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EXAMPLE STENCIL DESIGN
(0.4) TYP
(0.4) TYP
25X (
0.25)
(R0.05) TYP
4225306/A 09/2019
DSBGA - 0.5 mm max height
YFP0025
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 40X
METAL
TYP
C
1
2
A
B
D
E
3
4
5