6-43
HDC-P1
(NR-80P BOARD)
Ref. No.
or Q’ty Part No. SP Description
R154 1-208-887-81 s RES, CHIP 1.0K (1005)
R155 1-208-887-81 s RES, CHIP 1.0K (1005)
R156 1-208-887-81 s RES, CHIP 1.0K (1005)
R157 1-208-887-81 s RES, CHIP 1.0K (1005)
R158 1-208-863-81 s RES, CHIP 100 (1005)
R159 1-208-863-81 s RES, CHIP 100 (1005)
R162 1-208-863-81 s RES, CHIP 100 (1005)
R163 1-218-929-81 s RES, CHIP 10
-------------
PA-353P BOARD
-------------
Ref. No.
or Q’ty Part No. SP Description
C1 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C2 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C3 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C4 1-100-816-21 s CAP, ELECT 33MF (5.6X6.5)
C5 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C6 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C7 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C8 1-100-816-21 s CAP, ELECT 33MF (5.6X6.5)
C9 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C10 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C11 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C12 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C15 1-100-597-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C16 1-100-597-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C17 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C18 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C19 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C20 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C21 1-100-597-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C22 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C23 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C24 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C25 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C26 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C27 1-100-597-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C28 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C29 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C30 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C31 1-135-349-21 s CAP, ELECT 22MF (6.3X6)
C32 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C33 1-164-840-81 s CAP, CHIP CERAMIC 1PF CK 1005
C34 1-164-840-81 s CAP, CHIP CERAMIC 1PF CK 1005
C35 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C36 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C37 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C38 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C39 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C40 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C41 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C42 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C45 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C46 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C47 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C48 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C49 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C50 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C51 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C52 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C53 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C54 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C55 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C56 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C57 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C58 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C59 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C60 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C61 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C62 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C63 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
Summary of Contents for Power HADFX HDC-P1
Page 1: ...HD MULTI PURPOSE CAMERA HDC P1 MAINTENANCE MANUAL 1st Edition ...
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Page 238: ...Sony Corporation HDC P1 SY J E 9 968 724 01 Printed in Japan 2010 2 08 2010 ...