6-33
HDC-P1
(DR-632P BOARD)
Ref. No.
or Q’ty Part No. SP Description
R99 1-208-863-81 s RES, CHIP 100 (1005)
R100 1-208-863-81 s RES, CHIP 100 (1005)
R101 1-208-863-81 s RES, CHIP 100 (1005)
R102 1-208-863-81 s RES, CHIP 100 (1005)
R103 1-220-870-81 s RES, CHIP 10 (1005)
RB1 1-234-381-21 s RES, NETWORK 100K (1005X4)
RB2 1-234-381-21 s RES, NETWORK 100K (1005X4)
RB3 1-234-381-21 s RES, NETWORK 100K (1005X4)
RB4 1-234-381-21 s RES, NETWORK 100K (1005X4)
-------------
IF-1129 BOARD
-------------
Ref. No.
or Q’ty Part No. SP Description
1pc A-1755-695-A s MOUNTED CIRCUIT BOARD, IF-1129
BT200 1-756-076-21 s HOLDER, LITHIUM BATTERY
C1 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C2 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C3 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C4 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C5 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C6 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C7 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C8 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C9 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C10 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C11 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C12 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C13 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C14 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C16 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C17 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C18 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C19 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C21 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C22 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C23 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C24 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C25 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C26 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C27 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C28 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C29 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C30 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C200 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C201 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C202 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C203 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C204 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C205 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C206 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C207 1-104-905-11 s CAP, DOUBLE LAYERS 0.22F
C208 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C209 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C210 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C211 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C212 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C214 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C215 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C216 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C217 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C218 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C219 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C220 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C221 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C222 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C223 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C224 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C225 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C226 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
C227 1-114-582-91 o CAP, CERAMIC 0.1MF B 1005
Summary of Contents for Power HADFX HDC-P1
Page 1: ...HD MULTI PURPOSE CAMERA HDC P1 MAINTENANCE MANUAL 1st Edition ...
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Page 238: ...Sony Corporation HDC P1 SY J E 9 968 724 01 Printed in Japan 2010 2 08 2010 ...