6-41
HDC-P1
------------
NR-80P BOARD
------------
Ref. No.
or Q’ty Part No. SP Description
1pc A-1708-086-A s MOUNTED CIRCUIT BOARD, NR-80P
C4 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C5 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C8 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C9 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C10 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C11 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C12 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C13 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C14 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C15 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C16 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C17 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C18 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C19 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C20 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C21 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C22 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C23 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C24 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C25 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C26 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C27 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C28 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C29 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C30 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C31 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C32 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C33 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C34 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C35 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C36 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C37 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C38 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C39 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C40 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C41 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C49 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C50 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C51 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C52 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C53 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C54 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C55 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C56 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C57 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C58 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C59 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C60 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C61 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C62 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C63 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C64 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C65 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C68 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C69 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C70 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C71 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
(NR-80P BOARD)
Ref. No.
or Q’ty Part No. SP Description
C75 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C76 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C77 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C78 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C82 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C83 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C84 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C85 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C86 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C87 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C88 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C89 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C90 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C93 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C94 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C95 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C96 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C97 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C98 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C99 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C100 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C101 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C104 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C105 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C106 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C107 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C108 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C109 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C110 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C111 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C112 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
CN1 1-794-142-31 s CONNECTOR, FFC/FPC(ZIF) AN 36P
CN2 1-778-645-31 s CONNECTOR, FFC/FPC(ZIF) AN 10P
D1 8-719-989-04 s DIODE DAN222-TL
FB1 1-469-108-21 s FERRITE, EMI (SMD) (1608)
IC3 6-711-696-01 s IC CY62256VNLL-70ZXCT
IC5 6-712-631-01 s IC CAT24C256XI-T2C
IC6 8-759-669-67 s IC TL074CPWR-12
IC7 8-759-561-46 s IC AD8014ARTZ-REEL7
IC8 8-759-561-46 s IC AD8014ARTZ-REEL7
IC9 6-706-358-01 s IC AD5424YCPZ-REEL7
IC10 8-759-592-47 s IC TC7SZ08FU(TE85R)
IC11 6-704-099-01 s IC TC7WZ08FK(TE85R)
IC12 8-759-327-01 s IC NJM062V(TE2)
IC13 6-705-673-01 s IC TC7PA53FU(TE85L.F)
IC14 6-705-673-01 s IC TC7PA53FU(TE85L.F)
IC15 8-759-561-46 s IC AD8014ARTZ-REEL7
IC16 8-759-561-46 s IC AD8014ARTZ-REEL7
IC17 8-759-561-46 s IC AD8014ARTZ-REEL7
IC18 6-705-673-01 s IC TC7PA53FU(TE85L.F)
IC19 6-704-099-01 s IC TC7WZ08FK(TE85R)
IC20 6-705-673-01 s IC TC7PA53FU(TE85L.F)
IC21 8-759-561-46 s IC AD8014ARTZ-REEL7
IC22 8-759-561-46 s IC AD8014ARTZ-REEL7
IC23 6-705-673-01 s IC TC7PA53FU(TE85L.F)
IC24 6-704-099-01 s IC TC7WZ08FK(TE85R)
Summary of Contents for Power HADFX HDC-P1
Page 1: ...HD MULTI PURPOSE CAMERA HDC P1 MAINTENANCE MANUAL 1st Edition ...
Page 4: ......
Page 8: ......
Page 36: ......
Page 50: ......
Page 88: ......
Page 106: ......
Page 112: ......
Page 166: ......
Page 168: ......
Page 170: ......
Page 178: ......
Page 184: ......
Page 192: ......
Page 200: ......
Page 204: ......
Page 238: ...Sony Corporation HDC P1 SY J E 9 968 724 01 Printed in Japan 2010 2 08 2010 ...