Table 7.5. Package Dimensions
Symbol
Dimensions
Min
Typ
Max
Total Thickness
A
0.9
1
1.1
Substrate Thickness
A1
0.26 REF
Mold Thickness
A2
0.7 REF
Body Size
D
6 BSC
E
6 BSC
Lead Width
W
0.18
0.23
0.28
Lead Length
L
0.3
0.35
0.4
Lead Pitch
e
0.5 BSC
Edge Ball Center to Center
D1
4.5 BSC
E1
4.5 BSC
Body Center to Contact Ball
SD
0.25 BSC
SE
0.25 BSC
SD1
0.695 BSC
SE1
0.695 BSC
EP Width
W1
1.19
1.24
1.29
EP Length
L1
1.19
1.24
1.29
EP Pitch
e1
1.39 BSC
EP Count
n1
4
Package Edge Tolerance
aaa
0.1
Mold Flatness
bbb
0.1
Coplanarity
ddd
0.08
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si5332 Data Sheet • Package Outline
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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Rev. 1.3 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 16, 2021
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