Table 5.14. LGA Thermal Characteristics (Si5332E/F/G/H/L Only)
Parameter
Symbol
Test Condition
Value
Units
Si5332 — 48 LGA
Thermal Resistance, Junction to Ambient
θ
JA
Still Air
31.5
°C/W
Air Flow 1 m/s
28.5
Air Flow 2 m/s
27.4
Thermal Resistance, Junction to Case
θ
JC
19.4
Thermal Resistance, Junction to Board
θ
JB
20.2
ψ
JB
Still Air
20.2
Thermal Resistance, Junction to Top Center
ψ
JT
0.4
Si5332 — 40 LGA
Thermal Resistance, Junction to Ambient
θ
JA
Still Air
29.9
°C/W
Air Flow 1 m/s
26.5
Air Flow 2 m/s
25.3
Thermal Resistance, Junction to Case
θ
JC
19.6
Thermal Resistance, Junction to Board
θ
JB
18.9
ψ
JB
Still Air
18.9
Thermal Resistance, Junction to Top Center
ψ
JT
0.4
Si5332 — 32 LGA
Thermal Resistance, Junction to Ambient
θ
JA
Still Air
35.21
°C/W
Air Flow 1 m/s
32.9
Air Flow 2 m/s
31.7
Thermal Resistance, Junction to Case
θ
JC
19.8
Thermal Resistance, Junction to Board
θ
JB
24.3
ψ
JB
Still Air
24.3
Thermal Resistance, Junction to Top Center
ψ
JT
0.5
Note:
1. Based on Si5332 CEVB, see
for layout information.
Si5332 Data Sheet • Electrical Specifications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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Rev. 1.3 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 16, 2021
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