Table 5.13. QFN Thermal Characteristics (Si5332A/B/C/D Only)
Parameter
Symbol
Test Condition
Value
Units
Si5332 — 48 QFN
Thermal Resistance, Junction to Ambient
θ
JA
Still Air
27.2
°C/W
Air Flow 1 m/s
22.7
Air Flow 2 m/s
21.8
Thermal Resistance, Junction to Case
θ
JC
14
Thermal Resistance, Junction to Board
θ
JB
11.3
ψ
JB
Still Air
9.5
Thermal Resistance, Junction to Top Center
ψ
JT
0.4
Si5332 — 40 QFN
Thermal Resistance, Junction to Ambient
θ
JA
Still Air
23.1
°C/W
Air Flow 1 m/s
17.5
Air Flow 2 m/s
16.5
Thermal Resistance, Junction to Case
θ
JC
14.1
Thermal Resistance, Junction to Board
θ
JB
11.4
ψ
JB
Still Air
3.4
Thermal Resistance, Junction to Top Center
ψ
JT
0.4
Si5332 — 32 QFN
Thermal Resistance, Junction to Ambient
θ
JA
Still Air
28.4
°C/W
Air Flow 1 m/s
24
Air Flow 2 m/s
23
Thermal Resistance, Junction to Case
θ
JC
18.5
Thermal Resistance, Junction to Board
θ
JB
15.1
ψ
JB
Still Air
7
Thermal Resistance, Junction to Top Center
ψ
JT
0.5
Note:
1. Based on JEDEC standard 4-layer PCB.
Si5332 Data Sheet • Electrical Specifications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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Rev. 1.3 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 16, 2021
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