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DMTA-10045-01EN, Rev. E, August 2016
Overview of the BondMaster 600
25
delamination are present. Any changes in the part's mechanical impedance are
reflected in the amplitude and phase displayed on the instrument screen. Resonance
mode is typically used to detect metal-to-metal disbonds and interply delaminations.
In carbon fiber or fiberglass composites, the location of the defect can often be
estimated using the phase deflection on the instrument screen.
2.2
Connectors
Figure 2-1 on page 25 illustrates the connections of the BondMaster 600 with the
charger/adaptor, the microSD card, and a personal computer (PC).
Figure 2
‑
1 The BondMaster 600 connections
To power
outlet
DC power plug
EP-MCA-X
charger/adaptor
AC power cord
USB to PC
microSD card
Summary of Contents for BondMaster 600
Page 8: ...DMTA 10045 01EN Rev E August 2016 Table of Contents viii ...
Page 10: ...DMTA 10045 01EN Rev E August 2016 List of Abbreviations x ...
Page 26: ...DMTA 10045 01EN Rev E August 2016 Important Information Please Read Before Use 16 ...
Page 28: ...DMTA 10045 01EN Rev E August 2016 Introduction 18 ...
Page 32: ...DMTA 10045 01EN Rev E August 2016 Chapter 1 22 ...
Page 72: ...DMTA 10045 01EN Rev E August 2016 Chapter 3 62 ...
Page 78: ...DMTA 10045 01EN Rev E August 2016 Chapter 4 68 Figure 4 2 Crosshairs and the NULL point ...
Page 130: ...DMTA 10045 01EN Rev E August 2016 Chapter 5 120 ...
Page 216: ...DMTA 10045 01EN Rev E August 2016 Chapter 7 206 ...
Page 230: ...DMTA 10045 01EN Rev E August 2016 Appendix A 220 ...
Page 234: ...DMTA 10045 01EN Rev E August 2016 Appendix B 224 ...
Page 240: ...DMTA 10045 01EN Rev E August 2016 List of Figures 230 ...
Page 242: ...DMTA 10045 01EN Rev E August 2016 List of Tables 232 ...