NOVOTEST T-UD3, Operating Manual, Page: 2 / 53

Operation Manual
Hardness Tester NOVOTEST T-UD3
Page. 2
CONTENT
1 DESCRIPTION AND OPERATION OF THE DEVICE AND ITS COMPONENTS ......................... 5
1.1 The purpose of the device ............................................................................................................... 5
1.2 Technical characteristics of the device ........................................................................................... 5
1.3 Standard delivery set ....................................................................................................................... 7
1.4 Purpose of the probes ...................................................................................................................... 7
1.5 Parts ................................................................................................................................................. 8
1.5.1 Ultrasonic Contact Impedance Probe U1 probe ..................................................................... 10
1.5.2 Leeb probe.............................................................................................................................. 10
1.6 Design and functioning ................................................................................................................. 11
1.6.1 Modes ..................................................................................................................................... 11
1.6.2 Leeb measurement principle (Leeb) ...................................................................................... 12
1.6.3 Ultrasonic Contact Impedance method .................................................................................. 12
1.7 Means of measurement, tools and accessories .............................................................................. 13
1.8 Marking and sealing ...................................................................................................................... 13
1.9 Packing .......................................................................................................................................... 13
2 INTENDED USE ................................................................................................................................. 14
2.1 Operational limitations .................................................................................................................. 14
2.2 Preparing the device for use .......................................................................................................... 14
2.2.1 Visual inspection .................................................................................................................... 14
2.2.2 Installing the batteries ............................................................................................................ 14
2.2.3 Connecting the Probe ............................................................................................................. 15
2.3 Using the device ............................................................................................................................ 15
2.3.1 Preparing the object of testing ............................................................................................... 15
2.3.2 Turning on .............................................................................................................................. 16
2.3.3 Charging the battery ............................................................................................................... 17
2.3.4 Measurements using Ultrasonic Contact Impedance Probe U1 ............................................. 18
2.3.5 Measurements with the Leeb Probe (dynamic)...................................................................... 21
2.3.6 Measurement modes .............................................................................................................. 24
2.3.7 Calibration .............................................................................................................................. 28
2.3.8 Settings ................................................................................................................................... 34
2.3.9 Archive ................................................................................................................................... 34
2.3.10 Memory card ........................................................................................................................ 35
2.3.11 Information........................................................................................................................... 36
2.3.12 Photo fixation of the measurements ..................................................................................... 36
2.3.13 Connecting to PC ................................................................................................................. 38
3 TECHNICAL MAINTENANCE OF THE PRODUCT AND ITS COMPONENTS ......................... 43
3.1 Security measures ......................................................................................................................... 43