User’s Manual U18438EJ2V0UD
68
CHAPTER 7 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 7-1. Surface Mounting Type Soldering Conditions
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260
°
C, Time: 60 seconds max. (at 220
°
C or higher),
Count: Three times or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C
for 20 to 72 hours)
IR60-207-3
Partial heating
Pin temperature: 350
°
C max., Time: 3 seconds max. (per pin row)
−
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.