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User’s Manual U15104EJ2V0UD
CHAPTER 21 RECOMMENDED SOLDERING CONDITIONS
The
µ
PD178053, 178054, and 178F054 should be soldered and mounted under the following recommended
conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales
representative.
Table 21-1. Surface Mounting Type Soldering Conditions
µ
PD178053GC-
×××
-8BT: 80-pin plastic QFP (14
×
14)
µ
PD178054GC-
×××
-8BT: 80-pin plastic QFP (14
×
14)
µ
PD178F054GC-8BT:
80-pin plastic QFP (14
×
14)
Soldering
Soldering Conditions
Recommended
Method
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
IR35-00-2
(at 210
°
C or higher), Count: Twice or less
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
VP15-00-2
(at 200
°
C or higher), Count: Twice or less
Wave soldering
Soldering bath temperature: 260
°
C or less, Time: 10 seconds max.,
WS60-00-1
Count: Once, Preheating temperature: 120
°
C max. (package surface temperature)
Partial heating
Pin temperature: 300
°
C or less, Time: 3 seconds max. (per pin row)
–
Caution
Do not use different soldering methods together (except for partial heating).