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24. Appendix
24-1.
Embedding the sensor
Model Minimum
bending radius
LSMS-20K-S06 5.0
mm
LSMS-50K-S06 5.0
mm
LSMS-100K-S06 5.0
mm
LSMS-200K-S06 5.0
mm
LSMS-500K-S06 5.0
mm
LSMS-1T-S06 9.0
mm
LSMS-3T-S06 16.0
mm
Method with the ejector pin flange exposed
Method of embedding the ejector pin flange
Ejector plate (Upper)
Ejector plate (Lower)
Ejector pin
Ejector plate (Upper)
Ejector plate (Lower)
Ejector pin
Ejector plate (Lower)
Minimum bending
radius 5 mm
Do not bend close to the sensor.
If the ejector pin flange diameter is larger than the
sensor outer diameter, counterbore as shown in the
figure below to accommodate the flange diameter.
If the ejector pin has a large radius as shown in the
figure below, chamfer the upper face of the ejector
plate to prevent interference.
Summary of Contents for MPC-201-25
Page 1: ...Molding Pressure Conversion Module MPC 201 25 Instruction Manual EN294 1697G ...
Page 2: ......
Page 14: ...XII ...
Page 18: ...XVI 24 4 Vertically positioning the ejector plate 102 24 5 Removing a sensor 103 ...
Page 33: ...15 3 Right click to display the context menu and select Properties ...
Page 34: ...16 4 Click on Update Driver in the Driver tab 5 Select Browse my computer for driver software ...
Page 43: ...25 5 Overlay screen 6 Trend Peak Pressure screen 7 Trend Integral screen ...
Page 122: ......
Page 123: ......