Intel Xeon E5-2400, Thermal/Mechanical Design Manual

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4 Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
5.8 DTS Based Thermal Specification .........................................................................41
5.8.1
Compliance to Tcase Based Thermal Profile ................................................41
5.8.2 Considerations for Follow-on Processor ......................................................41
5.8.3 DTS Based Thermal Profile, Tcontrol and Margin
for the Intel® Xeon® Processor E5-2400 Product Family .............................41
5.8.4 Power Calculation for the Intel® Xeon® Processor E5-2400 Product Family ....42
5.8.5 Averaging the DTS Based Thermal Specification for the
Intel® Xeon® Processor E5-2400 Product Family........................................42
5.8.6 Capabilities for the Follow-on Processor .....................................................43
6 Quality and Reliability Requirements .......................................................................45
6.1 Test Conditions .................................................................................................45
6.2 Intel Reference Component Validation ..................................................................45
6.2.1
Board Functional Test Sequence ...............................................................45
6.2.2 Post-Test Pass Criteria.............................................................................45
6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................46
6.3 Material and Recycling Requirements....................................................................46
A Component Suppliers ...............................................................................................47
A.1 Intel Enabled Supplier Information .......................................................................47
A.1.1
Intel Reference Thermal Solution ..............................................................47
A.1.2 Intel Collaboration Thermal Solution..........................................................47
A.1.3 Alternative Thermal Solution ....................................................................48
A.1.4 Socket, ILM and Back Plate ......................................................................50
B Mechanical Drawings ...............................................................................................51
C Socket Mechanical Drawings ....................................................................................85
D Processor Installation Tool ......................................................................................91
E Embedded Thermal Solutions ...................................................................................93
E.1 Performance Targets ..........................................................................................93
E.2 Thermal Design Guidelines..................................................................................94
E.2.1
High Case Temperature Thermal Profile .....................................................94
E.3 Mechanical Drawings and Supplier Information ......................................................95
Figures
1-1 Intel® Xeon® Processor E5-2400 Product Family Platform Socket Stack .................... 9
2-1 LGA1356 Socket with Pick and Place Cover Removed..............................................13
2-2 LGA1356 Socket Contact Numbering (Top View of Socket) ......................................14
2-3 LGA1356 Socket Land Pattern (Top View of Board).................................................15
2-4 Attachment to Motherboard.................................................................................16
2-5 Pick and Place Cover ..........................................................................................17
2-6 Package Installation / Removal Features ...............................................................18
2-7 Package and Board Enabling Mark (-2) .................................................................19
2-8 LGA1356 NCTF Solder Joints ...............................................................................21
3-1 ILM Assembly....................................................................................................24
3-2 Back Plate ........................................................................................................25
3-3 ILM Assembly....................................................................................................26
3-4 Pin1 and ILM Lever ............................................................................................27
4-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology...........................32
5-1 Best-fit Equations ..............................................................................................34
5-2 1U Reference Heatsink Assembly .........................................................................35
5-3 Processor Thermal Characterization Parameter Relationships ...................................37
B-1 Board Keepin / Keepout Zones (Sheet 1 of 4) ........................................................52