Intel® Xeon® Processor E5-2400 Product Family
15
Thermal/Mechanical Design Guide
LGA1356 Socket
2.1
Board Layout
The land pattern for the LGA1356 socket is 40 mils X 40 mils (X by Y). Note that there
is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch
(40 mil) as these values are equivalent.
In general, metal defined (MD) pads perform better than solder mask defined (SMD)
pads under thermal cycling, and SMD pads perform better than MD pads under
dynamic stress. At this time, complete recommendations for pad definition and pad size
do not exist for the LGA1356 socket. See
for more information on pad
definition and pad size.
Figure 2-3. LGA1356 Socket Land Pattern (Top View of Board)
Summary of Contents for Xeon E5-2400
Page 8: ...8 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
