LGA1356 Socket
20
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
2.7
Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
2.8
Socket Size
Socket information needed for motherboard design is given in
This information should be used in conjunction with the reference motherboard keepout
drawings provided in
to ensure compatibility with the reference thermal
mechanical components.
2.9
LGA1356 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
for post environmental testing. The processor signals at NCTF locations are typically
redundant ground or non-critical reserved, so the loss of the solder joint continuity at
end of life conditions will not affect the overall product functionality.
identifies the NCTF solder joints.
Since corner pads are often more susceptible to solder joint damage, NCTF locations
are often placed in the corners. When possible, larger pads may be chosen at NCTF
locations to further mitigate against solder joint damage. At this time, complete
recommendations for pad definition and pad size do not exist at NCTF locations. CTF
and NCTF locations are 18mil solder mask defined on Intel reference designs.
Summary of Contents for Xeon E5-2400
Page 8: ...8 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
