Embedded Thermal Solutions
94
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Detailed drawings for the ATCA reference heatsink can be found in
.
above specifies
Ψ
CA
and pressure drop targets and
below shows
Ψ
CA
and pressure drop for the ATCA heatsink versus the airflow provided. Best-fit
equations are provided to prevent errors associated with reading the graph.
Other LGA1366 compatible thermal solutions may work with the same retention.
ATCA 13 mm heatsink performance using Intel
®
Xeon
®
processor 5500 series TTV.
E.2
Thermal Design Guidelines
E.2.1
High Case Temperature Thermal Profile
Processors that offer a High case temperature thermal profile are specified in the
Intel® Xeon® Processor E5-2400 Product Family Datasheet - Volume One
.
High case temperature thermal profiles help relieve thermal constraints for Short-Term
NEBS conditions. To help reliability, processors must meet the nominal thermal profile
under standard operating conditions and can only rise up to the Short-Term spec for
NEBS excursions (see
). The definition of Short-Term time is clearly defined
for NEBS Level 3 conditions but the key is that it cannot be longer than 360 hours per
year.
Fan speed control is treated the same as standard processors. When DTS (Digital
Temperature Sensor) value is less than Tcontrol, the thermal profile can be ignored.
Figure E-1. ATCA Heatsink Performance Curves
0
0.4
0.8
1.2
1.6
2
0
0.5
1
1.5
2
2.5
0
5
10
15
20
25
30
35
Δ
P,
i
n
c
h
w
a
te
r
Ψ
ca
, C
/W
CFM Through Fins
Δ
P = 1.3e-1.1e-02CFM
Mean
Ψ
ca
= 0.337 + 1.625 CFM
-0.939
Summary of Contents for Xeon E5-2400
Page 8: ...8 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
