Intel® Xeon® Processor E5-2400 Product Family
37
Thermal/Mechanical Design Guide
Thermal Solutions
5.5
Fan Speed Control
5.5.1
Fundamentals
In server platforms, processors often share airflow provided by system fans with other
system components such as chipset, memory and hard drives. As such, the thermal
control features in chipset, memory and other components not covered in this
document, should influence system fan speed control to reduce fan power consumption
and help systems meet acoustic targets.
The addition of thermal sensors placed in the system (for example, on front panel or
motherboard) to augment internal device sensors (for example, in processor, chipset
and memory) will improve the ability to implement need-based fan speed control. The
placement of system sensors in cooling zones, where each zone has dedicated fan(s),
can improve the ability to tune fan speed control for optimal performance and/or
acoustics.
System events such as fan or power supply failure, device events such as TCC
Activation or THERMTRIP, and maintenance events such as hot swap time allowance,
need to be comprehended to implement appropriate fan speed control to prevent
undesirable performance or loss of data. For more information on device events and
features see the appropriate processor Datasheet
.
Tcontrol and its upper and lower limits defined by hysteresis, can be used to avoid fan
speed oscillation and undesirable noise variations.
5.6
Thermal Features
More information regarding processor thermal features is contained in the appropriate
datasheet.
Figure 5-3. Processor Thermal Characterization Parameter Relationships
Summary of Contents for Xeon E5-2400
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