Intel® Xeon® Processor E5-2400 Product Family
19
Thermal/Mechanical Design Guide
LGA1356 Socket
2.4.1
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See
for the calculated IHS height above the motherboard.
2.5
Durability
The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from
must be met when mated in the 1st and 30th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
2.6
Markings
There are three markings on the socket:
• LGA1356: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1356 and the manufacturer's insignia are molded or laser marked on the side wall.
Figure 2-7. Package and Board Enabling Mark (-2)
Summary of Contents for Xeon E5-2400
Page 8: ...8 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
