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Intel® Xeon® Processor E5-2400 Product Family
25
Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM) and Back Plate
3.2
Assembly of ILM to a Motherboard
The ILM design allows a bottoms up assembly of the components to the board. In step
1 (see
), the back plate is placed in a fixture. Holes in the motherboard
provide alignment to the threaded studs.
In step 2, the ILM assembly is placed over the socket and threaded studs. The Intel
Reference Design ILM cover is not designed to nest over the Pick and Place cover. This
feature helps prevent reinstallation of the Pick and Place cover, a step that can lead to
socket bent contacts.
To prevent the ILM cover from popping off during ILM assembly, the load plate can be
unlatched from the load lever when the fasteners are torqued as shown is Step 3. Using
a T20 Torx* driver, fasten the ILM assembly to the back plate with the four captive
fasteners. Torque to 9 ± 1 inch-pounds.
The Pick and Place cover can then be removed as shown in Step 4, and the load plate
can then closed and latched as shown in Step5.
The length of the threaded studs accommodate board thicknesses from
0.062” to 0.100”.
Figure 3-2. Back Plate
Summary of Contents for Xeon E5-2400
Page 8: ...8 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...