LGA1356 Socket
16
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
2.2
Attachment to Motherboard
The socket is attached to the motherboard by 1356 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, and so on) to attach the
socket.
As indicated in
, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
2.3
Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to
for detailed
drawings.
2.3.1
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in the LGA1366 Socket
Validation Reports, and the LGA1356 Addendum.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
2.3.2
Solder Balls
A total of 1356 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and
4% and a melting temperature of approximately 217 °C. The alloy must be
Figure 2-4. Attachment to Motherboard
LGA1356
Socket
ILM
Summary of Contents for Xeon E5-2400
Page 8: ...8 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Page 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
