Intel® Xeon® Processor E5-2400 Product Family
9
Thermal/Mechanical Design Guide
Introduction
1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for server and workstation processors in the Intel® Xeon® Processor E5-2400 Product
Family platform. The processors covered include those listed in the
Intel® Xeon®
Processor E5-2400 Product Family Datasheet - Volume One
. The components described
in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1356 socket, the Independent Loading Mechanism (ILM) and back plate.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the appropriate
Datasheet.
Figure 1-1. Intel® Xeon® Processor E5-2400 Product Family Platform Socket Stack
Summary of Contents for Xeon E5-2400
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