General Specifications
Intel® Server Board SE7520AF2 TPS
242
Revision
1.2
Intel order number C77866-003
10. General Specifications
10.1 Estimated Mean-Time Between Failures (MTBF)
The estimated Mean-time Between Failures (MTBF) is calculated at 67,640 hours at a
maximum operating temperature of 35 C.
10.2 Absolute Maximum Ratings
Operating an SE7520AF2 baseboard at conditions beyond those shown in the following table
may cause permanent damage to the system. The table is provided for stress testing purposes
only. Exposure to absolute maximum rating conditions for extended periods may affect system
reliability.
Table 142. Absolute Maximum Ratings
Operating Temperature
0 degrees C to 55 degrees C
Non-operating Temperature
-40 degrees C to +70 degrees C
Voltage on any signal with respect to ground
-0.3 V to Vdd + 0.3V
3.3 V Supply Voltage with Respect to ground
-0.3 V to 3.63 V
5 V Supply Voltage with Respect to ground
-0.3 V to 5.5 V
Notes:
1. Chassis design must provide proper airflow to avoid exceeding Intel
Xeon processor maximum
case temperature.
2. VDD means supply voltage for the device
Note:
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components which need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation can
not be held responsible, if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
10.3 Processor Power Support
The SE7520AF2 is designed to support the Thermal Design Point (TDP) guideline for Intel®
Xeon™ processors. In addition, the Flexible Motherboard Guidelines (FMB) have been followed
to help determine the suggested thermal and current design values for anticipating future
processor needs. The following table provides maximum values for Icc, TDP power and T
CASE
for the Intel® Xeon™ processor family
Table 143. Intel® Xeon™ processor DP TDP Guidelines