Intel S2600IP, Technical Product Specification

Page: 41 / 186

Intel® Server Board S2600IP and Intel® Workstation Board W2600CR TPS Functional Architecture
Revision 1.1 27
Intel order number G34153-003

Minimum memory configuration: independent channel support with 1 DIMM populated

Integrated dual SMBus* master controllers

Command launch modes of 1n/2n

RAS Support:
o
Rank Level Sparing and Device Tagging
o
Demand and Patrol Scrubbing
o
DRAM Single Device Data Correction (SDDC) for any single x4 or x8 DRAM device.
Independent channel mode supports x4 SDDC. x8 SDDC requires lockstep mode
o
Lockstep mode where channels 0 and 1 and channels 2 and 3 are operated in
lockstep mode
o
Data scrambling with address to ease detection of write errors to an incorrect
address.
o
Error reporting from Machine Check Architecture
o
Read Retry during CRC error handling checks by iMC
o
Channel mirroring within a socket

CPU1 Channel Mirror Pairs (A,B) and (C,D)

CPU2 Channel Mirror Pairs (E,F) and (G,H)
o
Error Containment Recovery

Improved Thermal Throttling with dynamic Closed Loop Thermal Throttling (CLTT)

Memory thermal monitoring support for DIMM temperature
3.2.2.1 Supported Memory
Table 3. UDIMM Support Guidelines
Ranks
Per
DIMM
and
Data
Width
Memory Capacity Per
DIMM
1
Speed (MT/s) and Voltage Validated by
Slot per Channel (SPC) and DIMM Per Channel (DPC)
2,3
2 Slots per Channel
1DPC 2DPC
1.35V 1.5V 1.35V 1.5V
SRx8
Non-
ECC 1GB 2GB 4GB n/a 1066, 1333 n/a 1066, 1333
DRx8
Non-
ECC 2GB 4GB 8GB n/a 1066, 1333 n/a 1066, 1333
SRx16
Non-
ECC 512MB 1GB 2GB n/a 1066, 1333 n/a 1066, 1333
SRx8
ECC
1GB 2GB 4GB 1066,1333 1066, 1333 1066 1066, 1333
DRx8
ECC
2GB 4GB 8GB 1066,1333 1066, 1333 1066 1066, 1333
Notes :
1. Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by Intel.
2. Command Address Timing is 1N for 1DPC and 2N for 2DPC.
Supported and Validated
Supported but not Validate