Intel M70KLP Series, Service Manual

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Intel® Server System M70KLP Family Service Guide
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5.8.2 Power Distribution Board (PDB) Installation
1. Locate and unpack the new replacement PDB.
Figure 93. Power Distribution Board Installation
2. Carefully position the PDB to the front side of power supply bay and align it over the main power
connector slots on the server board (see Letters A and B).
3. Push down on the PDB until fully seated within the slots on the server board (see Letter C)
4. Tighten the blue thumbscrew to secure the PDB to the power supply bay (see Letter D).
5. Align and insert the PDB cable to the matching connector on the server board (see Letter E).
6. Reinstall the system air duct and top cover (see Section 2.2 ).
5.9 Processor Replacement
Processors in this system are part of an assembly referred to as a PHM (Processor Heat sink Module). A PHM
consists of a processor, a processor carrier clip, and the processor heat sink, which is preassembled into a
single module before placement onto the processor socket assembly on the server board. The PHM concept
reduces the risk of damaging pins within the processor socket during the replacement process.
Components Required:
• New matching 3 rd Gen Intel® Xeon® processor Scalable pro included shipping tray
• Existing processor carrier clip
• New processor heat sink or existing processor heat sink + new thermal interface material (TIM)
Required Tools and Supplies
• Anti-static wrist strap, an ESD safe workbench, and other anti-ESD precautions (recommended)
• ESD Gloves (recommended)
• T-30 Torx* screwdriver
Average Time to Complete: ~10+ minutes
Procedure Prerequisites
• The system must be powered off and AC Power cord(s) disconnected.
•
Remove the system top cover and air duct (see Sections 2.1.1 and 2.1.2 ).
Caution: Fin edges of the processor heat sink are very sharp. Intel recommends wearing thin ESD protective
gloves when handling the PHM during the following procedures.