Intel Intel E7500 MCH, Thermal Design Manual

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4 Thermal Design Guide
Contents
Figures
1 Thermal Design Process .............................................................................................................. 5
2 Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Package Dimensions .......................................... 7
3 90° Angle Attach Methodology ................................................................................................... 14
4 0° Angle Attach Methodology ..................................................................................................... 15
5 0° Angle Attach Heat Sink Modifications .................................................................................... 15
6 Thermal Solution Decision Flowchart ......................................................................................... 16
7 Theta ja versus Airflow for the Reference Thermal Solution ...................................................... 18
8 Reference Heat Sink Volumetric Envelope for the MCH ............................................................ 19
9 Reference Thermal Solution Assembly Using Retention Method A ........................................... 20
10 Heat Sink Retention Mechanism Layout for Retention Method A .............................................. 21
11 Retention Mechanism Component Keep-out Zones for Retention Method A............................. 21
12 Reference Thermal Solution Assembly Using Retention Method B ........................................... 22
13 Board Component Keep-out for Retention Method B ................................................................. 23
14 Heat Sink Mechanical Gasket, Optional Two-Piece ................................................................... 24
15 MCH Heat Sink ........................................................................................................................... 32
16 Heat Sink Clip ............................................................................................................................. 33
17 Push-pin ..................................................................................................................................... 34
Tables
1 Definition of Terms ....................................................................................................................... 6
2 Reference Documents .................................................................................................................. 6
3 Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Specifications ..................................... 11
4 Theta ja Required versus Device and Configuration .................................................................. 17
5 Reliability Requirements ............................................................................................................. 25
6 Mechanical Drawing List............................................................................................................. 31
Revision History
Date Revision Description
March 2003 002
Revised Table 3, “Intel
®
E7500 and Intel
®
E7501 Chipsets
MCH Thermal Specifications.”
Revised Table 4, “Theta ja Required versus Device and
Configuration.”
November 2002 001 Initial release of this document.