Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
Thermal Design Guide
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7.0
Conclusion
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Heat may be dissipated
using improved system cooling, selective use of ducting, and/or passive heat sinks.
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system
thermal solutions. The size of the fan or heat sink may be varied to balance size and space
constraints with acoustic noise.
This document has presented the conditions and requirements to properly design a cooling solution
for systems implementing Intel
®
E7500 or Intel
®
E7501 chipsets in an embedded application.
Properly designed solutions provide adequate cooling to maintain the chipset die temperatures at or
below thermal specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By
maintaining the chipset MCH die temperature at or below those recommended in this document, a
system designer may ensure the proper functionality, performance, and reliability of these chipsets.
