Intel Intel E7500 MCH, Thermal Design Manual

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Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
6 Thermal Design Guide
1.4 Definition of Terms
Table 1 lists the definitions of terms used in this document.
1.5 Reference Documents
Table 2 lists the reference documents and related document number or source.
Table 1. Definition of Terms
Term Definition
BGA
Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical interface is
an array of solder balls attached to the substrate opposite the die and molding compound.
ICH3-S
I/O Controller Hub. The chipset component that contains the primary PCI interface, LPC
interface, USB, ATA-100, and other legacy functions.
MBGA Mini Ball Grid Array. A version of the BGA with a smaller ball pitch.
MCH
Memory Controller Hub. The chipset component that contains the processor interface and
the memory interface.
FC-BGA
Flip Chip Ball Grid Array. A packaging technology used for the Intel
®
E7500 and Intel
®
E7501
chipset MCHs.
P64H2 Bus Controller Hub. The chipset component that interfaces the PCI-X buses.
T
case-nhs
The maximum package case temperature without any package thermal solution. This
temperature is measured at the geometric center of the top of the package case.
T
die-nhs
The maximum die temperature without any package thermal solution. This temperature is
measured at the geometric center of the top of the package die.
T
die-hs
The maximum die temperature with the reference thermal solution attached. This
temperature is measured at the geometric center of the top of the package die.
TDP
Thermal Design Power. Thermal solutions should be designed to dissipate this target power
level.
Table 2. Reference Documents
Document Document Number
Intel
®
E7500, Intel
®
E7501, and Intel
®
E7505 Chipsets MCH Thermal
Design Guidelines
298647
Low Voltage Intel
®
Xeon
TM
Processor for Embedded Applications
Thermal Design Guidelines
273764
Intel
®
Xeon™ Processor MP Thermal Design Guidelines 298650
Intel
®
PCI-64 Hub 2 (P64H2) Thermal Design Guidelines Contact your local Intel Representative
Intel
®
82801CA I/O Controller Hub 3 (ICH3-S) Datasheet 290733
Intel
®
E7500 and Intel
®
E7501 Chipset Flotherm* Model and User’s
Guide
Contact your local Intel Representative
Thermal Design Suggestions for Various Form Factors Available at http://www.formfactors.org
Intel
®
E7500 Chipset MCH Thermal Testing Software Contact your local Intel Representative
Intel
®
Xeon
™
Processor Thermal Design Guidelines 298348