Intel Intel E7500 MCH Thermal Design Manual Download Page 29

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Intel

E7500 and Intel

E7501 Chipsets MCH Thermal Design Guide

Thermal Design Guide

Appendix A Thermal Solution Component Suppliers

A.1

Extruded Pin Fin Heat Sink

A.2

Materials for Retention Method A

A.3

Materials for Retention Method B

Part

Supplier (Part Number)

Contact Information

Pin Fin Heat Sink
(Includes heat sink and attached
thermal interface material)

CoolerMaster (ECB-00028-01)

Wendy Lin

886-2-3434-0050, x333

[email protected]

Part

Qty Required

(per assy)

Intel Part

Number

Supplier

Contact Information

Heatsink Clip

A69230-001

CCI/ACK

Harry Lin

714-739-5797

[email protected]

Foxconn

Bob Hall

503-693-3509 x235

[email protected]

Board Mount Solder-Down Anchors
(Two anchors required per heat sink.)

A13494-005

Foxconn

Julia Jiang

(408) 919-6178

[email protected]

Part

Supplier (Part Number)

Contact Information

Push-Pin

Peninsula Components (PL 1674)

Steve Blank

(562) 694-4477

[email protected]

NOTE:

Four push-pins are required per heat sink.

Summary of Contents for Intel E7500 MCH

Page 1: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide for Embedded Applications March 2003 Order Number 273819 002...

Page 2: ...ent characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Copies of document...

Page 3: ...nd Thermal Performance 17 6 2 Mechanical Design Envelope 18 6 3 Thermal Solution Assembly 19 6 3 1 Retention Method A 20 6 3 1 1 Heat Sink Orientations 20 6 3 1 2 Board Level Keep out Dimensions 20 6...

Page 4: ...t Keep out Zones for Retention Method A 21 12 Reference Thermal Solution Assembly Using Retention Method B 22 13 Board Component Keep out for Retention Method B 23 14 Heat Sink Mechanical Gasket Optio...

Page 5: ...nt Scope This document addresses thermal design and specifications for the Intel E7500 and Intel E7501 chipset MCH components only For thermal design information on other chipset components refer to t...

Page 6: ...mperature without any package thermal solution This temperature is measured at the geometric center of the top of the package case Tdie nhs The maximum die temperature without any package thermal solu...

Page 7: ...r hub P64H2 and I O controller hub ICH3 S The Intel E7500 and E7501 MCHs utilize a 42 5 mm 6 layer FC BGA package shown in Figure 2 Refer to the Intel PCI 64 Hub 2 P64H2 Thermal Design Guidelines for...

Page 8: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 8 Thermal Design Guide This page intentionally left blank...

Page 9: ...nalyzing and optimizing their thermal solutions in an integrated system level environment The models are for use with the commercially available Computational Fluid Dynamics CFD based thermal analysis...

Page 10: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 10 Thermal Design Guide This page intentionally left blank...

Page 11: ...cified in Table 3 Refer to Section 5 0 for guidelines on accurately measuring package die temperatures Table 3 Intel E7500 and Intel E7501 Chipsets MCH Thermal Specifications Device Parameter Maximum...

Page 12: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 12 Thermal Design Guide This page intentionally left blank...

Page 13: ...troduce error in the measurements The measurement errors may be due to a poor thermal contact between the thermocouple junction and the surface of the package heat loss by radiation and or convection...

Page 14: ...of the heat sink base 4 Cut out portions of the TIM to make room for the thermocouple wire and bead The cutouts should match the slot and hole milled into the heat sink base 5 Attach a 36 gauge or sm...

Page 15: ...Figure 4 shows the 0 angle attach methodology Figure 5 shows the 0 angle attach heat sink modifications Figure 4 0 Angle Attach Methodology NOTE Drawing represents the top view and is not to scale Fig...

Page 16: ...ed solely for testing customer thermal solutions at near the thermal design power Figure 6 shows a decision flowchart for determining thermal solution needs Real future applications may exceed the the...

Page 17: ...conditions are met the reference thermal solution will meet the thermal specifications for the Intel E7500 and Intel E7501 chipset MCHs in all memory and Hub Interface configurations See Figure 7 for...

Page 18: ...Intel E7501 chipset MCHs in embedded environments are shown in Figure 8 These constraints assume the use of the CompactPCI blade form factor When using heat sinks that extend beyond the MCH reference...

Page 19: ...ldered to the board The second method Retention Method B employs the use of four push pins through the board using the four holes provided on the heat sink This method might face layout constraints as...

Page 20: ...aligned as shown in Figure 9 The heat sink holes on the same side of the heat sink must be parallel with the clip that applies pressure through the center of the heat sink The airflow may approach the...

Page 21: ...for Retention Method A NOTE Drawing dimensions are in millimeters in and are not to scale 2X 30 45 1 199 2X 28 17 1 109 56 34 2 218 60 91 2 398 MCH PIN1 Figure 11 Retention Mechanism Component Keep ou...

Page 22: ...mper and is soldered to the board like any common through hole header A new anchor design is available with 45 bent leads to increase the anchor attach reliability over time See Appendix A Thermal Sol...

Page 23: ...be mounted in either the vertical or horizontal position atop the MCH depending on hole placement Aligning the heat sink 45 relative to the airflow is acceptable but delivers reduced thermal performa...

Page 24: ...ing The interface material reduces mechanical loads experienced by the die The reference thermal solution uses a picture frame gasket of 0 813 mm 0 032 in thick Poron foam The foam gasket is a two pie...

Page 25: ...Pass Fail Criteria2 Mechanical Shock 50 g board level 11 msec 3 shocks axis Visual Check and Electrical Functional Test Random Vibration 7 3 g board level 45 min axis 50 Hz to 2000 Hz Visual Check and...

Page 26: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 26 Thermal Design Guide This page intentionally left blank...

Page 27: ...in conjunction with system thermal solutions The size of the fan or heat sink may be varied to balance size and space constraints with acoustic noise This document has presented the conditions and re...

Page 28: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 28 Thermal Design Guide This page intentionally left blank...

Page 29: ...CB 00028 01 Wendy Lin 886 2 3434 0050 x333 wendy coolermaster com tw Part Qty Required per assy Intel Part Number Supplier Contact Information Heatsink Clip 1 A69230 001 CCI ACK Harry Lin 714 739 5797...

Page 30: ...ly available from all suppliers Contact the supplier directly to verify time of component availability Part Intel Part Number Supplier Contact Information Thermal Interface Powerstrate 51 Power Device...

Page 31: ...l Design Guide 31 Appendix B Mechanical Drawings Table 6 lists the mechanical drawings included in this section Table 6 Mechanical Drawing List Drawing Description Page Number MCH Heat Sink 32 Heat Si...

Page 32: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 32 Thermal Design Guide Figure 15 MCH Heat Sink Used by permission...

Page 33: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Thermal Design Guide 33 Figure 16 Heat Sink Clip...

Page 34: ...Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 34 Thermal Design Guide Figure 17 Push pin Used by permission...

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