Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
Thermal Design Guide
7
2.0
Packaging Technology
The Intel
®
E7500 and Intel
®
E7501 chipsets consist of three individual components, the memory
controller hub (MCH), bus controller hub (P64H2), and I/O controller hub (ICH3-S). The Intel
®
E7500 and E7501 MCHs utilize a 42.5 mm, 6-layer FC-BGA package shown in
. Refer to
the Intel
®
PCI-64 Hub 2 (P64H2) Thermal Design Guidelines for information on the P64H2
component and to the Intel
®
82801CA I/O Controller Hub 3 (ICH3-S) Datasheet for information
on the ICH3-S component.
Figure 2. Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Package Dimensions
NOTE: Dimensions are in mm.
