Intel Intel E7500 MCH, Thermal Design Manual

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Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
Thermal Design Guide 19
Figure 8 shows the reference heat sink volumetric envelope for the MCH.
6.3 Thermal Solution Assembly
The reference thermal solution is a passive extruded heat sink with thermal and mechanical
interfaces. There are two methods for attaching the heat sink to the motherboard. The first method
(Retention Method A) uses a clip with each end hooked through an anchor soldered to the board.
The second method (Retention Method B) employs the use of four push-pins through the board
using the four holes provided on the heat sink. This method might face layout constraints as the
four holes through the motherboard must be accounted for during board layout. Full mechanical
drawings of the thermal solution assembly and the heat sink clip may be found in
Appendix B,
“Mechanical Drawings.”
Appendix A, “Thermal Solution Component Suppliers” lists the Bill-of-Materials and vendor
information for each thermal solution component.
Figure 8. Reference Heat Sink Volumetric Envelope for the MCH
NOTE: Drawing dimensions are not to scale.