Intel Intel E7500 MCH, Thermal Design Manual

Page: 25 / 34

Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
Thermal Design Guide 25
6.4 Reliability Requirements
Each motherboard, heat sink, and attach combination may vary the mechanical loading of the
component. The user should carefully evaluate the reliability of the completed assembly prior to
use in high volume. Some general recommendations are presented in
Table 5 .
Table 5. Reliability Requirements
Test
1
Requirement Pass/Fail Criteria
2
Mechanical Shock 50 g, board level, 11 msec, 3 shocks/axis
Visual Check and Electrical
Functional Test
Random Vibration 7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz
Visual Check and Electrical
Functional Test
Temperature Life
85° C, 2000 hours total, checkpoints at 168, 500,
1000, and 2000 hours
Visual Check
Thermal Cycling -5° C to +70° C, 500 cycles Visual Check
Humidity 85% relative humidity, 55° C, 1000 hours Visual Check
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from three lots of
material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.