Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
16
Thermal Design Guide
5.2
Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design power on an
Intel
®
E7501 chipset MCH when used in conjunction with Intel
®
Xeon
™
processor(s) with 512
Kbytes L2 cache or a Low Voltage Intel
®
Xeon
™
processor with 512 Kbytes L2 cache. To assess
the thermal performance of the chipset MCH thermal solution under “worst-case realistic
application” conditions, Intel has developed a software utility that operates the chipset at near
worst-case power dissipation.
The utility has been developed solely for testing customer thermal solutions at near the thermal
design power.
shows a decision flowchart for determining thermal solution needs. Real
future applications may exceed the thermal design power limit for transient time periods. For
power supply current requirements under these transient conditions, please refer to each
component’s EDS or EDS Addendum for the I
CC
(Max Power Supply Current) specification
.
Contact your Intel Field Sales representative to obtain a copy of this software.
Figure 6. Thermal Solution Decision Flowchart
Attach thermocouples using
recommended metrology.
Setup the system in the
desired configuration.
Tdie >
Specification?
No
Yes
Heatsink required
Select Heatsink
End
Start
Run the Power
program and
monitor the device
die temperature.
Attach device
to board using
normal reflow
process.
