LGA1366 Socket
16
Thermal/Mechanical Design Guide
2.4
Package Installation / Removal
As indicated in
Figure 2-6
, access is provided to facilitate manual installation and
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
See
Appendix D
for information regarding a tool designed to provide mechanical
assistance during processor installation and removal.
.
2.4.1
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Appendix C
.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See
Section 4.2
for the calculated IHS height above the motherboard.
Figure 2-6. Package Installation / Removal Features
alignment
walls
orientation
notch
orientation
post
access
Pin1 triangle
Pin1 chamfer
alignment
walls
orientation
notch
orientation
post
access
Pin1 triangle
Pin1 chamfer
Summary of Contents for BX80616I3540
Page 10: ...Introduction 10 Thermal Mechanical Design Guide...
Page 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Page 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...
Page 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...
