Thermal/Mechanical Design Guide
11
LGA1366 Socket
2
LGA1366 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for
Intel® Xeon® Processor 3500 Series. The socket provides I/O, power and ground
contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the
socket with lead-free solder balls for surface mounting on the motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a
43x41 grid array with 21x17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Chapter 4
.
Figure 2-1. LGA1366 Socket with Pick and Place Cover Removed
socket
cavity
package
socket
cavity
package
Summary of Contents for BX80616I3540
Page 10: ...Introduction 10 Thermal Mechanical Design Guide...
Page 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Page 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...
Page 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...
