Thermal/Mechanical Design Guide
15
LGA1366 Socket
2.3.3
Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381
μ
m
[15
μ
inches] minimum gold plating over 1.27
μ
m [50
μ
inches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in
Chapter 7
without degrading.
As indicated in
Figure 2-5
, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in
Figure 2-5
, a Pin1 indicator on the cover provides a visual reference for proper
orientation with the socket.
Figure 2-5. Pick and Place Cover
Pin 1
Pin 1
Pick and
Place Cover
ILM
Installation
Summary of Contents for BX80616I3540
Page 10: ...Introduction 10 Thermal Mechanical Design Guide...
Page 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Page 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...
Page 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...
